Inventor

JIANG HENG

CN83 patents

⚠️ This page may combine multiple inventors who share the name “JIANG HENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JIANG HENG

NINGBO SUNNY OPOTECH CO LTD

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Adjustable optical lens and camera module and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Manufacturing method of molded photosensitive assembly for electronic device

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera lens module and manufacturing method thereof

Optical lens head, camera module and assembling method therefor

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

System-level camera module with electrical support and manufacturing method thereof

Adjustable optical lens and camera module and manufacturing method thereof

Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof

Camera lens module and manufacturing method thereof

Photographing module and electric bracket thereof

Camera lens module with one or more optical lens modules and manufacturing method thereof

Molded photosensitive assembly for array imaging module for electronic device

System-level camera module with electrical support and manufacturing method thereof

Camera lens module with one or more optical lens modules and manufacturing method thereof

Photosensitive assembly and camera module and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera lens module and manufacturing method thereof

Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device

Adjustable optical lens and camera module, manufacturing method and applications thereof

Multi-lens assembly, camera module and methods for manufacturing same

Camera lens module and manufacturing method thereof

Lens module and capturing module integrating focusing mechanism and assembly method therefor

Adjustable optical lens and camera module and manufacturing method thereof

Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Semiconductor packaging method and semiconductor device based on molding process

System-level camera module with electrical support and manufacturing method thereof

Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device

Semiconductor packaging method and semiconductor device based on molding process

Adjustable optical lens and camera module and manufacturing method thereof

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

JIANG HENG

Lamp

Lamp

Slipper

High top shoe

Sports cotton slipper

Sneaker cotton slipper

NINGBO SUNNY OPTOTECH CO LTD

System-level camera module with encapsulated electrical support