P

Inventor

TSAI CHUN-YANG

TW40 patents
⚠️ This page may combine multiple inventors who share the name “TSAI CHUN-YANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

29 patents
US10700070B2Jun 30, 2020

Embedded transistor

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9634134B2Apr 25, 2017

Embedded transistor

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9230647B2Jan 5, 2016

Metal line connection for improved RRAM reliability, semiconductor arrangement comprising the same, and manufacture thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10985316B2Apr 20, 2021

Bottom electrode structure in memory device

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations82
US10748907B2Aug 18, 2020

Embedded transistor

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10461126B2Oct 29, 2019

Memory circuit and formation method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10262731B2Apr 16, 2019

Device and method for forming resistive random access memory cell

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9991368B2Jun 5, 2018

Vertical BJT for high density memory

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9893122B2Feb 13, 2018

Metal line connection for improved RRAM reliability, semiconductor arrangement comprising the same, and manufacture thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9178040B2Nov 3, 2015

Innovative approach of 4F2 driver formation for high-density RRAM and MRAM

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11696521B2Jul 4, 2023

High electron affinity dielectric layer to improve cycling

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10879391B2Dec 29, 2020

Wakeup-free ferroelectric memory device

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12389814B2Aug 12, 2025

High electron affinity dielectric layer to improve cycling

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9472596B2Oct 18, 2016

Metal line connection for improved RRAM reliability, semiconductor arrangement comprising the same, and manufacture thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9153672B2Oct 6, 2015

Vertical BJT for high density memory

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US11107528B2Aug 31, 2021

Multi-step reset technique to enlarge memory window

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631810B2Apr 18, 2023

Bottom electrode structure in memory device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11594632B2Feb 28, 2023

Wakeup-free ferroelectric memory device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11315931B2Apr 26, 2022

Embedded transistor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10879310B2Dec 29, 2020

Memory circuit and formation method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10879309B2Dec 29, 2020

Memory circuit and formation method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10062735B2Aug 28, 2018

Innovative approach of 4F2 driver formation for high-density RRAM and MRAM

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9576656B2Feb 21, 2017

Device and method for setting resistive random access memory cell

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9543404B2Jan 10, 2017

Vertical BJT for high density memory

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9530462B2Dec 27, 2016

Memory cell with decoupled read/write path

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9520446B2Dec 13, 2016

Innovative approach of 4F2 driver formation for high-density RRAM and MRAM

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10861547B1Dec 8, 2020

Multi-step reset technique to enlarge memory window

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12482717B2Nov 25, 2025

Techniques for heat dispersion in 3D integrated circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9576651B2Feb 21, 2017

RRAM and method of read operation for RRAM

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42

TAIWAN SEMICONDUCTOR MFG

8 patents

TAIWAN SEMICONDCUTOR MFG COMPANY LTD

1 patent

CHIN ALBERT

1 patent

TSAI CHUN-YANG

1 patent