Inventor
LIU ZI-JHENG
TW27 patents
Patents
27 patentsUS10163858B1Dec 25, 2018
Semiconductor packages and manufacturing methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US10304700B2May 28, 2019
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations83
US10204870B2Feb 12, 2019
Semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US10937688B2Mar 2, 2021
Semiconductor package and method of fabricating semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10685896B2Jun 16, 2020
Integrated circuit package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10276428B2Apr 30, 2019
Semiconductor package and method of fabricating semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10090194B2Oct 2, 2018
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10049986B2Aug 14, 2018
Package structures and methods of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9786617B2Oct 10, 2017
Chip packages and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12469800B2Nov 11, 2025
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12218001B2Feb 4, 2025
Semiconductor package and method of fabricating semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125741B2Oct 22, 2024
Semiconductor package and method of fabricating semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094728B2Sep 17, 2024
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11862512B2Jan 2, 2024
Semiconductor package and method of fabricating semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11817399B2Nov 14, 2023
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11756929B2Sep 12, 2023
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11699598B2Jul 11, 2023
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11322479B2May 3, 2022
Semiconductor packages and manufacturing methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11177165B2Nov 16, 2021
Method of manufacturing a semiconductor device having redistribution layer including a dielectric layer made from a low-temperature cure polyimide
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11037877B2Jun 15, 2021
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11031351B2Jun 8, 2021
Method of manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867793B2Dec 15, 2020
Semiconductor package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11127688B2Sep 21, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867811B2Dec 15, 2020
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10692838B2Jun 23, 2020
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12197138B2Jan 14, 2025
Machine learning on overlay management
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10879166B2Dec 29, 2020
Package structure having redistribution structure with photosensitive and non-photosensitive dielectric materials and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41