P

Inventor

SUNDARAM ARVIND

IN31 patents
⚠️ This page may combine multiple inventors who share the name “SUNDARAM ARVIND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

30 patents
US11294127B2Apr 5, 2022

Free air intrasystem interconnect

INTEL CORP2 citations72
US10903913B2Jan 26, 2021

Free air optical interconnect attach mechanism

INTEL CORP6 citations72
US10756824B2Aug 25, 2020

Free air optical backplane interconnect

INTEL CORP6 citations72
US10523338B2Dec 31, 2019

Lens for free air optical interconnect

INTEL CORP2 citations72
US10516490B2Dec 24, 2019

Optical free air transmit and receive interconnect

INTEL CORP5 citations72
US10148365B2Dec 4, 2018

Hybrid free air and electrical interconnect

INTEL CORP6 citations72
US10747284B2Aug 18, 2020

Supplemental power reception by bypassing voltage regulator

INTEL CORP4 citations69
US11726278B2Aug 15, 2023

Free air intrasystem interconnect

INTEL CORP0 citations62
US10386568B2Aug 20, 2019

Combined rear cover and enhanced diffused reflector for display stack

INTEL CORP1 citations62
US11119542B2Sep 14, 2021

Hinge angle detection

INTEL CORP0 citations61
US11054870B2Jul 6, 2021

User position detection

INTEL CORP1 citations61
US12323558B2Jun 3, 2025

Technologies for video conferencing

INTEL CORP0 citations59
US12261318B2Mar 25, 2025

Technologies for battery retention

INTEL CORP0 citations58
US11895803B2Feb 6, 2024

Fan for an electronic device

INTEL CORP0 citations58
US11450936B2Sep 20, 2022

Transmission of data over conducting wires

INTEL CORP0 citations53
US10690836B2Jun 23, 2020

Display carrier attached light bar for backlit displays

INTEL CORP0 citations51
US10673536B2Jun 2, 2020

Free air optical interconnect beacon mode

INTEL CORP0 citations51
US10554304B2Feb 4, 2020

Mechanism for MIPI communication using optical interface

INTEL CORP0 citations51
US10187982B2Jan 22, 2019

Circuit board structures for thermal insulation and method of making same

INTEL CORP0 citations51
US10076021B1Sep 11, 2018

Method, device and system for facilitating heat dissipation from a circuit assembly

INTEL CORP1 citations51
US10366035B2Jul 30, 2019

Single wire communication board-to-board interconnect

INTEL CORP0 citations50
US10608311B2Mar 31, 2020

Cable assembly comprising a single wire coupled to a signal launcher and housed in a first cover portion and in a second ferrite cover portion

INTEL CORP0 citations49
US11126235B2Sep 21, 2021

Detection of transmission medium state for power delivery

INTEL CORP0 citations48
US10712779B2Jul 14, 2020

Unified chassis construction for all in one computer

INTEL CORP0 citations45
US10700790B2Jun 30, 2020

Optical driver circuitry for burst mode transfer

INTEL CORP0 citations41
US10643780B2May 5, 2020

Flexible inductor and method of providing same

INTEL CORP0 citations41
US10381310B2Aug 13, 2019

Embedded multi-die interconnect bridge

INTEL CORP0 citations41
US10236111B2Mar 19, 2019

Low-profile transformer and method of making same

INTEL CORP0 citations41
US10847859B2Nov 24, 2020

Single wire communication arrangement

INTEL CORP0 citations39
US10108258B2Oct 23, 2018

Multiple viewpoint image capture of a display user

INTEL CORP0 citations39

RAO RAGHAVENDRA RAMESH

1 patent