Inventor
KOO JEOUNG MO
SG32 patents
⚠️ This page may combine multiple inventors who share the name “KOO JEOUNG MO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES SG PTE LTD
26 patentsUS9362374B2Jun 7, 2016
Simple and cost-free MTP structure
GLOBALFOUNDRIES SG PTE LTD4 citations73
US11862693B2Jan 2, 2024
Semiconductor devices including a drain captive structure having an air gap and methods of forming the same
GLOBALFOUNDRIES SG PTE LTD2 citations72
US11764273B2Sep 19, 2023
Semiconductor structures for galvanic isolation
GLOBALFOUNDRIES SG PTE LTD3 citations72
US11469169B2Oct 11, 2022
High voltage decoupling capacitor and integration methods
GLOBALFOUNDRIES SG PTE LTD4 citations72
US11257949B2Feb 22, 2022
Transistor devices and methods of forming transistor devices
GLOBALFOUNDRIES SG PTE LTD3 citations72
US10347773B2Jul 9, 2019
Split gate non-volatile memory (NVM) with improved programming efficiency
GLOBALFOUNDRIES SG PTE LTD2 citations72
US10032766B2Jul 24, 2018
VDMOS transistors, BCD devices including VDMOS transistors, and methods for fabricating integrated circuits with such devices
GLOBALFOUNDRIES SG PTE LTD2 citations72
US10529819B2Jan 7, 2020
High voltage Schottky diode and manufacturing method thereof
GLOBALFOUNDRIES SG PTE LTD2 citations71
US10510831B2Dec 17, 2019
Low on resistance high voltage metal oxide semiconductor transistor
GLOBALFOUNDRIES SG PTE LTD2 citations71
US11282953B2Mar 22, 2022
Transistor devices and methods of forming a transistor device
GLOBALFOUNDRIES SG PTE LTD2 citations68
US9831304B1Nov 28, 2017
Integrated circuits with deep trench isolations and methods for producing the same
GLOBALFOUNDRIES SG PTE LTD3 citations68
US12550725B2Feb 10, 2026
Structure for galvanic isolation using dielectric-filled trench in substrate below electrode
GLOBALFOUNDRIES SG PTE LTD0 citations62
US12538551B2Jan 27, 2026
Semiconductor structures for galvanic isolation
GLOBALFOUNDRIES SG PTE LTD0 citations62
US11955514B2Apr 9, 2024
Field-effect transistors with a gate structure in a dual-depth trench isolation structure
GLOBALFOUNDRIES SG PTE LTD0 citations62
US11791379B2Oct 17, 2023
Galvanic isolation using isolation break between redistribution layer electrodes
GLOBALFOUNDRIES SG PTE LTD1 citations62
US11791392B2Oct 17, 2023
Extended-drain metal-oxide-semiconductor devices with a notched gate electrode
GLOBALFOUNDRIES SG PTE LTD0 citations62
US11456306B2Sep 27, 2022
Nonvolatile memory device with a metal-insulator-metal (MIM) capacitor in a substrate and integration schemes
GLOBALFOUNDRIES SG PTE LTD0 citations62
US10892317B2Jan 12, 2021
Power trench capacitor compatible with deep trench isolation process
GLOBALFOUNDRIES SG PTE LTD0 citations62
US10424655B2Sep 24, 2019
Dual gate LDMOS and a process of forming thereof
GLOBALFOUNDRIES SG PTE LTD1 citations62
US12176395B1Dec 24, 2024
Structures for a laterally-diffused metal-oxide-semiconductor transistor
GLOBALFOUNDRIES SG PTE LTD0 citations56
US12525537B2Jan 13, 2026
Transistors having backside contact structures
GLOBALFOUNDRIES SG PTE LTD0 citations55
US9525061B2Dec 20, 2016
Semiconductor device including an n-well structure
GLOBALFOUNDRIES SG PTE LTD1 citations52
US8853783B2Oct 7, 2014
ESD protection circuit
GLOBALFOUNDRIES SG PTE LTD1 citations52
US11502193B2Nov 15, 2022
Extended-drain metal-oxide-semiconductor devices with a multiple-thickness buffer dielectric layer
GLOBALFOUNDRIES SG PTE LTD0 citations51
US10355072B2Jul 16, 2019
Power trench capacitor compatible with deep trench isolation process
GLOBALFOUNDRIES SG PTE LTD0 citations51
US12336220B2Jun 17, 2025
Extended-drain metal-oxide-semiconductor devices with a gap between the drain and body wells
GLOBALFOUNDRIES SG PTE LTD0 citations46
SAMSUNG ELECTRONICS CO LTD
2 patentsUS7259419B2Aug 21, 2007
Programmable memory device, integrated circuit including the programmable memory device, and method of fabricating same
SAMSUNG ELECTRONICS CO LTD18 citations91
US7642592B2Jan 5, 2010
Programmable memory device, integrated circuit including the programmable memory device, and method of fabricating same
SAMSUNG ELECTRONICS CO LTD5 citations61