Inventor
HAN XINHAI
US46 patents
⚠️ This page may combine multiple inventors who share the name “HAN XINHAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
43 patentsUS9157730B2Oct 13, 2015
PECVD process
APPLIED MATERIALS INC49 citations97
US9816187B2Nov 14, 2017
PECVD process
APPLIED MATERIALS INC8 citations92
US9458537B2Oct 4, 2016
PECVD process
APPLIED MATERIALS INC12 citations92
US10793954B2Oct 6, 2020
PECVD process
APPLIED MATERIALS INC3 citations84
US10700087B2Jun 30, 2020
Multi-layer stacks for 3D NAND extendibility
APPLIED MATERIALS INC8 citations84
US10060032B2Aug 28, 2018
PECVD process
APPLIED MATERIALS INC3 citations84
US11569257B2Jan 31, 2023
Multi-layer stacks for 3D NAND extendability
APPLIED MATERIALS INC4 citations74
US11613812B2Mar 28, 2023
PECVD process
APPLIED MATERIALS INC2 citations73
US11501993B2Nov 15, 2022
Semiconductor substrate supports with improved high temperature chucking
APPLIED MATERIALS INC2 citations71
US11056406B2Jul 6, 2021
Stack of multiple deposited semiconductor layers
APPLIED MATERIALS INC2 citations71
US10276353B2Apr 30, 2019
Dual-channel showerhead for formation of film stacks
APPLIED MATERIALS INC4 citations71
US11530482B2Dec 20, 2022
Faceplate having a curved surface
APPLIED MATERIALS INC1 citations70
US11339475B2May 24, 2022
Film stack overlay improvement
APPLIED MATERIALS INC2 citations70
US10246772B2Apr 2, 2019
Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devices
APPLIED MATERIALS INC5 citations70
US9490116B2Nov 8, 2016
Gate stack materials for semiconductor applications for lithographic overlay improvement
APPLIED MATERIALS INC3 citations70
US11898249B2Feb 13, 2024
PECVD process
APPLIED MATERIALS INC0 citations62
US10030306B2Jul 24, 2018
PECVD apparatus and process
APPLIED MATERIALS INC1 citations62
US11837448B2Dec 5, 2023
High-temperature chamber and chamber component cleaning and maintenance method and apparatus
APPLIED MATERIALS INC0 citations61
US10490467B2Nov 26, 2019
Methods of forming a stack of multiple deposited semiconductor layers
APPLIED MATERIALS INC1 citations61
US12317493B2May 27, 2025
Methods of forming 3D NAND structures with decreased pitch
APPLIED MATERIALS INC0 citations60
US12110590B2Oct 8, 2024
Faceplate having a curved surface
APPLIED MATERIALS INC0 citations60
US11948846B2Apr 2, 2024
Analyzing in-plane distortion
APPLIED MATERIALS INC0 citations60
US11851759B2Dec 26, 2023
Faceplate having a curved surface
APPLIED MATERIALS INC0 citations60
US11637043B2Apr 25, 2023
Analyzing in-plane distortion
APPLIED MATERIALS INC0 citations60
US11622489B2Apr 4, 2023
3-D NAND control gate enhancement
APPLIED MATERIALS INC0 citations60
US11538677B2Dec 27, 2022
Systems and methods for depositing high density and high tensile stress films
APPLIED MATERIALS INC0 citations60
US11515324B2Nov 29, 2022
3D NAND structures with decreased pitch
APPLIED MATERIALS INC0 citations60
US11164882B2Nov 2, 2021
3-D NAND control gate enhancement
APPLIED MATERIALS INC1 citations60
US11365476B2Jun 21, 2022
Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devices
APPLIED MATERIALS INC1 citations59
US11776835B2Oct 3, 2023
Power supply signal conditioning for an electrostatic chuck
APPLIED MATERIALS INC0 citations58
US10199388B2Feb 5, 2019
VNAND tensile thick TEOS oxide
APPLIED MATERIALS INC1 citations58
US12566412B2Mar 3, 2026
Deposition thickness drift compensation in substrate processing systems
APPLIED MATERIALS INC0 citations54
US10553427B2Feb 4, 2020
Low dielectric constant oxide and low resistance OP stack for 3D NAND application
APPLIED MATERIALS INC0 citations52
US11276569B2Mar 15, 2022
On stack overlay improvement for 3D NAND
APPLIED MATERIALS INC0 citations51
US10475644B2Nov 12, 2019
Dielectric-metal stack for 3D flash memory application
APPLIED MATERIALS INC0 citations51
US9972487B2May 15, 2018
Dielectric-metal stack for 3D flash memory application
APPLIED MATERIALS INC1 citations51
US10002745B2Jun 19, 2018
Plasma treatment process for in-situ chamber cleaning efficiency enhancement in plasma processing chamber
APPLIED MATERIALS INC1 citations50
US10483282B2Nov 19, 2019
VNAND tensile thick TEOS oxide
APPLIED MATERIALS INC0 citations47
US12195846B2Jan 14, 2025
Modified stacks for 3D NAND
APPLIED MATERIALS INC0 citations45
US11145504B2Oct 12, 2021
Method of forming film stacks with reduced defects
APPLIED MATERIALS INC0 citations45
US12265379B2Apr 1, 2025
Methods and mechanisms for adjusting film deposition parameters during substrate manufacturing
APPLIED MATERIALS INC0 citations43
US11946140B2Apr 2, 2024
Hot showerhead
APPLIED MATERIALS INC0 citations43
US10790140B2Sep 29, 2020
High deposition rate and high quality nitride
APPLIED MATERIALS INC0 citations41