Inventor
CHO HUNG-CHUN
TW17 patents
Patents
17 patentsUS11456280B2Sep 27, 2022
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10833053B1Nov 10, 2020
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US12009331B2Jun 11, 2024
Integrated circuit packages having adhesion layers for through vias
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11791313B2Oct 17, 2023
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11417582B2Aug 16, 2022
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11270927B2Mar 8, 2022
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11164839B2Nov 2, 2021
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12550778B2Feb 10, 2026
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12519036B2Jan 6, 2026
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12394741B2Aug 19, 2025
Integrated circuit packages having adhesion layers for through vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12293988B2May 6, 2025
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12249588B2Mar 11, 2025
Semiconductor device and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11948863B2Apr 2, 2024
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11715717B2Aug 1, 2023
Methods of forming integrated circuit packages having adhesion layers over through vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11605607B2Mar 14, 2023
Semiconductor device and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11594472B2Feb 28, 2023
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322688B2Jun 3, 2025
Package structure including auxiliary dielectric portion
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51