Inventor

WAJIMA MOTOYO

37 patents

⚠️ This page may combine multiple inventors who share the name “WAJIMA MOTOYO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WAJIMA MOTOYO

HITACHI LTD

Circuit board and process for producing the same

Method of bonding copper and resin

Method for manufacture of printed wiring board

Multi-layer wiring structure

Process for producing printed circuit board

Hybrid multilayer wiring board

Composite of metal and resin having electrolytically reduced metal layer and process for producing the same

Transparent resin material containing metallic atoms bonded to pendent carboxylic acid groups

Multi-layer printed circuit board and process for production thereof

Electroless copper solution

Printed circuit board and method and apparatus for making same

Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition

Plastic optical fibers from polymers derived from metallic salts of ethylenic carboxyl monomers

Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material

Process for producing printed circuit boards

Process for electroless copper plating

Thermosetting resin composition comprising dicyanamide and polyvalent imide

Bismide-ether compounds, compositions thereof, and method of producing same

Thermosetting resin and prepreg and laminate using the same

Thermosetting resin and prepreg and laminate using the same

Thermosetting resin composition and laminate and process for the production thereof

Printed circuit board, process for preparing the same and resist ink used therefor

Heat-resistant resin from aromatic cyanamide compound and aromatic amine compound

Thermosetting resin composition and prepolymer thereof

Process for producing copper barrier type, nuclear fuel cladding

Process for forming printed wiring by electroless deposition

Thermosetting resin composition

Process for producing printed circuit board by electroless plating

Thermosetting resin composition and prepolymer obtained therefrom

Thermosetting resin composition comprising (1) dicyanamide, (2) polyvalent imide and (3) polymerizable compound

Thermo-setting, polymerizable composition and wiring board

Thermosetting resin composition from aromatic cyanamide

Resin composition and laminate produced therefrom comprising a cyclized polybutadiene and a prepolymer of a isocyanuric or cyanuric acid derivative

HITACHI CHEMICAL CO LTD

Thermosetting prepolymer from polyfunctional maleimide and bis maleimide

Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor

Imide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixture

Process for preparing thermosetting prepolymer from mixture of polyfunctional maleimide and bis-maleimide