Inventor
NISHIKAWA AKIO
16 patents
⚠️ This page may combine multiple inventors who share the name “NISHIKAWA AKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
15 patentsUS4128527ADec 5, 1978
Dynamoelectric machine having coil windings and core encapsulated with resin-filler composition
HITACHI LTD98 citations96
US4758875AJul 19, 1988
Resin encapsulated semiconductor device
HITACHI LTD67 citations95
US4562322ADec 31, 1985
SF6 Gas arc extinguishing electric apparatus and process for producing the same
HITACHI LTD30 citations91
US4460783AJul 17, 1984
Ether imides and process for producing the same
HITACHI LTD36 citations91
US4211686AJul 8, 1980
Unsaturated polyester resin composition for use in pressure molding
HITACHI LTD20 citations82
US4494217AJan 15, 1985
Semiconductor memories with α shield
HITACHI LTD24 citations81
US4435560AMar 6, 1984
Maleimide: aryloxy diamine resin composition and process for producing same
HITACHI LTD24 citations79
US5225499AJul 6, 1993
Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same
HITACHI LTD8 citations74
US4296219AOct 20, 1981
Bismide-ether compounds, compositions thereof, and method of producing same
HITACHI LTD7 citations74
US3963796AJun 15, 1976
Epoxy resin composition having excellent latent hardening characteristics
HITACHI LTD12 citations73
US4138372AFeb 6, 1979
Resin compositions containing polyepoxides and uretdiones
HITACHI LTD18 citations70
US5166283ANov 24, 1992
Polymer having dihydropyridine rings or dihydrotriazine rings, process for producing the same, and applications thereof
HITACHI LTD3 citations63
US4900807AFeb 13, 1990
Polymer from nitrile terminated compounds having Schiff bonds and process for preparing the same
HITACHI LTD3 citations63
US4278780AJul 14, 1981
Thermosetting resin composition comprising epoxy compound and reaction product of unsaturated dicarboxylic acid anhydride and excess diamine
HITACHI LTD5 citations62
US4056579ANov 1, 1977
Novel thermosetting resin composition and cured product therefrom
HITACHI LTD6 citations61