Inventor
OHSHIMA JIRO
JP17 patents
⚠️ This page may combine multiple inventors who share the name “OHSHIMA JIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
9 patentsUS4543707AOct 1, 1985
Method of forming through holes by differential etching of stacked silicon oxynitride layers
TOSHIBA KK116 citations93
US4975381ADec 4, 1990
Method of manufacturing super self-alignment technology bipolar transistor
TOSHIBA KK52 citations92
US4871685AOct 3, 1989
Method of manufacturing bipolar transistor with self-aligned external base and emitter regions
TOSHIBA KK33 citations92
US4853342AAug 1, 1989
Method of manufacturing semiconductor integrated circuit device having transistor
TOSHIBA KK24 citations92
US4717682AJan 5, 1988
Method of manufacturing a semiconductor device with conductive trench sidewalls
TOSHIBA KK30 citations92
US5102826AApr 7, 1992
Method of manufacturing a semiconductor device having a silicide layer
TOSHIBA KK30 citations91
US4766086AAug 23, 1988
Method of gettering a semiconductor device and forming an isolation region therein
TOSHIBA KK46 citations91
US4780426AOct 25, 1988
Method for manufacturing high-breakdown voltage semiconductor device
TOSHIBA KK17 citations74
US5382549AJan 17, 1995
Method of manufacturing polycrystalline silicon having columnar orientation
TOSHIBA KK9 citations71
TOKYO SHIBAURA ELECTRIC CO
8 patentsUS4334349AJun 15, 1982
Method of producing semiconductor device
TOKYO SHIBAURA ELECTRIC CO64 citations96
US4853760AAug 1, 1989
Semiconductor device having insulating layer including polyimide film
TOKYO SHIBAURA ELECTRIC CO36 citations92
US4502207AMar 5, 1985
Wiring material for semiconductor device and method for forming wiring pattern therewith
TOKYO SHIBAURA ELECTRIC CO8 citations74
US4479830AOct 30, 1984
Method of manufacturing a semiconductor device using epitaxially regrown protrusion as an alignment marker
TOKYO SHIBAURA ELECTRIC CO9 citations74
US4415372ANov 15, 1983
Method of making transistors by ion implantations, electron beam irradiation and thermal annealing
TOKYO SHIBAURA ELECTRIC CO7 citations74
US4426234AJan 17, 1984
Method of forming reproducible impurity zone of gallium or aluminum in a wafer by implanting through composite layers and diffusion annealing
TOKYO SHIBAURA ELECTRIC CO6 citations63
US4404736ASep 20, 1983
Method for manufacturing a semiconductor device of mesa type
TOKYO SHIBAURA ELECTRIC CO3 citations63
US4515642AMay 7, 1985
Method of forming deep aluminum doped silicon by implanting Al and Si ions through alumina layer and device formed thereby
TOKYO SHIBAURA ELECTRIC CO3 citations62