Inventor
SEKIGUCHI SUSUMU
JP23 patents
⚠️ This page may combine multiple inventors who share the name “SEKIGUCHI SUSUMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
20 patentsUS6251990B1Jun 26, 2001
Silicone rubber compositions having high-voltage electrical insulation, sealing and repairing compounds for polymeric insulators
SHINETSU CHEMICAL CO49 citations92
US6106954AAug 22, 2000
Silicone rubber compositions for high-voltage electrical insulators and polymeric bushings
SHINETSU CHEMICAL CO23 citations92
US6063487AMay 16, 2000
Silicone rubber compositions for high-voltage electrical insulators and polymer insulators
SHINETSU CHEMICAL CO19 citations92
US5502146AMar 26, 1996
Method of producing silicone rubber compositions
SHINETSU CHEMICAL CO20 citations92
US5977216ANov 2, 1999
Silicone rubber compositions for high-voltage electrical insulators and polymeric bushings
SHINETSU CHEMICAL CO11 citations74
US5550185AAug 27, 1996
Silicone rubber composition
SHINETSU CHEMICAL CO12 citations74
US5449714ASep 12, 1995
Preparation of conductive silicone rubber composition
SHINETSU CHEMICAL CO12 citations74
US6232387B1May 15, 2001
Silicone rubber compositions for high-voltage electrical insulators
SHINETSU CHEMICAL CO4 citations63
US6162854ADec 19, 2000
Silicone rubber compositions for high-voltage electrical insulators
SHINETSU CHEMICAL CO5 citations63
US5449735ASep 12, 1995
Process for producing organopolysiloxane with high polymerization degree
SHINETSU CHEMICAL CO2 citations63
US7510772B2Mar 31, 2009
Fluorosilicone rubber composition and molded rubber article
SHINETSU CHEMICAL CO2 citations61
US8044121B2Oct 25, 2011
Cement mold-making silicone rubber composition
SHINETSU CHEMICAL CO4 citations56
US9449856B2Sep 20, 2016
Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus
SHINETSU CHEMICAL CO1 citations52
US9287174B2Mar 15, 2016
Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus
SHINETSU CHEMICAL CO0 citations52
US9240332B2Jan 19, 2016
Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
SHINETSU CHEMICAL CO0 citations52
US9129912B2Sep 8, 2015
Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
SHINETSU CHEMICAL CO0 citations52
US5468830ANov 21, 1995
Process for preparing organopolysiloxane gum
SHINETSU CHEMICAL CO1 citations52
US9401290B2Jul 26, 2016
Semiconductor apparatus and method for producing the same
SHINETSU CHEMICAL CO0 citations41
US9129976B2Sep 8, 2015
Method of manufacturing semiconductor apparatus and semiconductor apparatus
SHINETSU CHEMICAL CO0 citations41
US8872358B2Oct 28, 2014
Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
SHINETSU CHEMICAL CO0 citations41