Inventor
DIETZE WOLFGANG
DE21 patents
⚠️ This page may combine multiple inventors who share the name “DIETZE WOLFGANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SIEMENS AG
18 patentsUS4148931AApr 10, 1979
Process for depositing elemental silicon semiconductor material from a gas phase
SIEMENS AG32 citations91
US4125643ANov 14, 1978
Process for depositing elemental silicon semiconductor material from a gas phase
SIEMENS AG41 citations91
US3943218AMar 9, 1976
Method of manufacturing shaped hollow bodies
SIEMENS AG21 citations81
US4093201AJun 6, 1978
Disc support structure
SIEMENS AG20 citations77
US4426408AJan 17, 1984
Method of deposition of silicon in fine crystalline form
SIEMENS AG9 citations73
US4345142AAug 17, 1982
Directly heatable semiconductor tubular bodies
SIEMENS AG9 citations73
US4102298AJul 25, 1978
Device for deposition of semi-conductor material
SIEMENS AG15 citations73
US4007369AFeb 8, 1977
Tubular oven
SIEMENS AG7 citations73
US3979490ASep 7, 1976
Method for the manufacture of tubular bodies of semiconductor material
SIEMENS AG9 citations73
US3962670AJun 8, 1976
Heatable hollow semiconductor
SIEMENS AG8 citations73
US4255463AMar 10, 1981
Method of deposition of silicon in fine crystalline form
SIEMENS AG16 citations72
US4035460AJul 12, 1977
Shaped bodies and production of semiconductor material
SIEMENS AG8 citations72
US4203940AMay 20, 1980
Crystal wafer rack structures and the method of producing the same
SIEMENS AG20 citations71
US3962391AJun 8, 1976
Disc support structure and method of producing the same
SIEMENS AG16 citations68
US4532090AJul 30, 1985
Method and apparatus for the manufacture of high purity silicon granulate
SIEMENS AG8 citations65
US4034705AJul 12, 1977
Shaped bodies and production of semiconductor material
SIEMENS AG2 citations61
US4475206AOct 2, 1984
Method and device for tapping a furnace containing a tappable melt
SIEMENS AG1 citations52
US4015922AApr 5, 1977
Apparatus for the manufacture of tubular bodies of semiconductor material
SIEMENS AG0 citations34