Inventor

HOFFMAN PAUL R

US50 patents

⚠️ This page may combine multiple inventors who share the name “HOFFMAN PAUL R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOFFMAN PAUL R

OLIN CORP

Metal ball grid array package with improved thermal conductivity

Ball grid array electronic package standoff design

Components for housing an integrated circuit device

Metal electronic package with reduced seal width

Metal electronic package with reduced seal width

Electronic package having improved wire bonding capability

Ground ring for a metal electronic package

Multi-chip electronic package module utilizing an adhesive sheet

Polymer plug for electronic packages

Chamfered electronic package component

Semiconductor package with chip redistribution interposer

Electronic package having controlled epoxy flow

Semiconductor package having a ground or power ring and a metal substrate

Guard ring for integrated circuit package

DECA TECH USA INC

Semiconductor assembly comprising a 3D block and method of making the same

Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages

Semiconductor assembly comprising a 3D block and method of making the same

Molded direct contact interconnect structure without capture pads and method for the same

Molded direct contact interconnect structure without capture pads and method for the same

Molded bridge with vertical interconnects and method of making the same

Method of making a fan-out semiconductor assembly with an intermediate carrier

Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same

Encapsulant-defined land grid array (LGA) package and method for making the same

Fully molded structure with multi-height components comprising backside conductive material and method for making the same

Molded direct contact interconnect substrate and methods of making same

Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same

Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same

AMKOR TECHNOLOGY INC

Thermally enhanced chip scale lead on chip semiconductor package

Thermally enhanced chip scale lead on chip semiconductor package and method of making same

Thermally enhanced chip scale lead on chip semiconductor package and method of making same

Thermally enhanced chip scale lead on chip semiconductor package and method of making same

AEM HOLDINGS LTD

Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones

Thermal head for independent control of zones

Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones

Thermal head for independent control of zones

PLASTI FAB CO LTD

Food processor tool holder

Food processor tool holder

Food processor tool holder

Food processor tool holder

ADVANCED INTERCONNECT TECH LTD

Ball grid array electronic package

Edge connectable metal package

Metal ball grid electronic package having improved solder joint

BURROUGHS CORP

Liquid jet droplet generator

Air turbulence control of inflight ink droplets in non-impact recorders

EXXON RESEARCH ENGINEERING CO

Floppy disc drive

Floppy disc drive

IBM

Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester

TYLER GRIFFIN COMPANY

Playing card coding system and apparatus for dealing coded cards

MERCK PATENT GMBH

Pearlscent pigment and process for producing the same

AEM SINGAPORE PTE LTD

Thermal head comprising a plurality of adapters for independent thermal control of zones