Inventor
RAMIREZ GERMAN J
US5 patents
Patents
5 patentsUS5688606ANov 18, 1997
Anodized aluminum substrate having increased breakdown voltage
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US5534356AJul 9, 1996
Anodized aluminum substrate having increased breakdown voltage
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US5455386AOct 3, 1995
Chamfered electronic package component
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US5239131AAug 24, 1993
Electronic package having controlled epoxy flow
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US5877551AMar 2, 1999
Semiconductor package having a ground or power ring and a metal substrate
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