Inventor
KANG SUKHVINDER SINGH
US9 patents
Patents
9 patentsUS5870286AFeb 9, 1999
Heat sink assembly for cooling electronic modules
IBM92 citations97
US5757998AMay 26, 1998
Multigigabit adaptable transceiver module
IBM136 citations97
US6084775AJul 4, 2000
Heatsink and package structures with fusible release layer
IBM54 citations95
US6061240AMay 9, 2000
Push pin assembly for heat sink for cooling electronic modules
IBM61 citations95
US5978223ANov 2, 1999
Dual heat sink assembly for cooling multiple electronic modules
IBM87 citations95
US6000623ADec 14, 1999
System packaging for high performance computer applications
IBM98 citations94
US5940266AAug 17, 1999
Bi-directional cooling arrangement for use with an electronic component enclosure
IBM76 citations94
US6542359B2Apr 1, 2003
Apparatus and method for cooling a wearable computer
IBM52 citations91
US5923531AJul 13, 1999
Enhanced circuit board arrangement for a computer
IBM50 citations89