Inventor

HUANG RUEY-SHING

TW2 patents

⚠️ This page may combine multiple inventors who share the name “HUANG RUEY-SHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IND TECH RES INST

1 patent

US6070851AJun 6, 2000

Thermally buckling linear micro structure

IND TECH RES INST19 citations89

ASIA PACIFIC MICROSYSTEMS INC

1 patent

US6864176B2Mar 8, 2005

Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method

ASIA PACIFIC MICROSYSTEMS INC0 citations45