Inventor
FOOTE DAVID K
US40 patents
⚠️ This page may combine multiple inventors who share the name “FOOTE DAVID K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
34 patentsUS6406960B1Jun 18, 2002
Process for fabricating an ONO structure having a silicon-rich silicon nitride layer
ADVANCED MICRO DEVICES INC83 citations98
US6218292B1Apr 17, 2001
Dual layer bottom anti-reflective coating
ADVANCED MICRO DEVICES INC93 citations98
US5710067AJan 20, 1998
Silicon oxime film
ADVANCED MICRO DEVICES INC171 citations98
US6458677B1Oct 1, 2002
Process for fabricating an ONO structure
ADVANCED MICRO DEVICES INC57 citations96
US6040619AMar 21, 2000
Semiconductor device including antireflective etch stop layer
ADVANCED MICRO DEVICES INC67 citations95
US6248628B1Jun 19, 2001
Method of fabricating an ONO dielectric by nitridation for MNOS memory cells
ADVANCED MICRO DEVICES INC68 citations94
US6365320B1Apr 2, 2002
Process for forming anti-reflective film for semiconductor fabrication using extremely short wavelength deep ultraviolet photolithography
ADVANCED MICRO DEVICES INC24 citations93
US6121663ASep 19, 2000
Local interconnects for improved alignment tolerance and size reduction
ADVANCED MICRO DEVICES INC16 citations93
US6562683B1May 13, 2003
Bit-line oxidation by removing ONO oxide prior to bit-line implant
ADVANCED MICRO DEVICES INC49 citations92
US6528390B2Mar 4, 2003
Process for fabricating a non-volatile memory device
ADVANCED MICRO DEVICES INC44 citations92
US6436766B1Aug 20, 2002
Process for fabricating high density memory cells using a polysilicon hard mask
ADVANCED MICRO DEVICES INC36 citations92
US6410388B1Jun 25, 2002
Process for optimizing pocket implant profile by RTA implant annealing for a non-volatile semiconductor device
ADVANCED MICRO DEVICES INC39 citations92
US6399446B1Jun 4, 2002
Process for fabricating high density memory cells using a metallic hard mask
ADVANCED MICRO DEVICES INC21 citations92
US6395644B1May 28, 2002
Process for fabricating a semiconductor device using a silicon-rich silicon nitride ARC
ADVANCED MICRO DEVICES INC26 citations92
US6313018B1Nov 6, 2001
Process for fabricating semiconductor device including antireflective etch stop layer
ADVANCED MICRO DEVICES INC20 citations92
US6297143B1Oct 2, 2001
Process for forming a bit-line in a MONOS device
ADVANCED MICRO DEVICES INC30 citations92
US6248635B1Jun 19, 2001
Process for fabricating a bit-line in a monos device using a dual layer hard mask
ADVANCED MICRO DEVICES INC36 citations92
US6114235ASep 5, 2000
Multipurpose cap layer dielectric
ADVANCED MICRO DEVICES INC32 citations92
US6022799AFeb 8, 2000
Methods for making a semiconductor device with improved hot carrier lifetime
ADVANCED MICRO DEVICES INC24 citations92
US5990524ANov 23, 1999
Silicon oxime spacer for preventing over-etching during local interconnect formation
ADVANCED MICRO DEVICES INC40 citations92
US5989957ANov 23, 1999
Process for fabricating semiconductor memory device with high data retention including silicon oxynitride etch stop layer formed at high temperature with low hydrogen ion concentration
ADVANCED MICRO DEVICES INC27 citations92
US5963841AOct 5, 1999
Gate pattern formation using a bottom anti-reflective coating
ADVANCED MICRO DEVICES INC45 citations92
US6903007B1Jun 7, 2005
Process for forming bottom anti-reflection coating for semiconductor fabrication photolithography which inhibits photoresist footing
ADVANCED MICRO DEVICES INC12 citations84
US6399480B1Jun 4, 2002
Methods and arrangements for insulating local interconnects for improved alignment tolerance and size reduction
ADVANCED MICRO DEVICES INC7 citations74
US6242305B1Jun 5, 2001
Process for fabricating a bit-line using buried diffusion isolation
ADVANCED MICRO DEVICES INC10 citations74
US6103611AAug 15, 2000
Methods and arrangements for improved spacer formation within a semiconductor device
ADVANCED MICRO DEVICES INC13 citations74
US5895269AApr 20, 1999
Methods for preventing deleterious punch-through during local interconnect formation
ADVANCED MICRO DEVICES INC15 citations74
US6168993B1Jan 2, 2001
Process for fabricating a semiconductor device having a graded junction
ADVANCED MICRO DEVICES INC11 citations73
US6060393AMay 9, 2000
Deposition control of stop layer and dielectric layer for use in the formation of local interconnects
ADVANCED MICRO DEVICES INC4 citations63
US6376308B1Apr 23, 2002
Process for fabricating an EEPROM device having a pocket substrate region
ADVANCED MICRO DEVICES INC4 citations62
US6207502B1Mar 27, 2001
Method of using source/drain nitride for periphery field oxide and bit-line oxide
ADVANCED MICRO DEVICES INC5 citations62
US6486029B1Nov 26, 2002
Integration of an ion implant hard mask structure into a process for fabricating high density memory cells
ADVANCED MICRO DEVICES INC6 citations60
US6380588B1Apr 30, 2002
Semiconductor device having uniform spacers
ADVANCED MICRO DEVICES INC4 citations60
US6063665AMay 16, 2000
Method for silicon surface control for shallow junction formation
ADVANCED MICRO DEVICES INC0 citations52