Inventor
FUERNISS STEPHEN JOSEPH
US10 patents
Patents
10 patentsUS6150726ANov 21, 2000
Component carrier with raised bonding sites
IBM51 citations95
US6015520AJan 18, 2000
Method for filling holes in printed wiring boards
IBM84 citations95
US5759737AJun 2, 1998
Method of making a component carrier
IBM62 citations95
US6156484ADec 5, 2000
Gray scale etching for thin flexible interposer
IBM78 citations94
US5940729AAug 17, 1999
Method of planarizing a curved substrate and resulting structure
IBM41 citations91
US6129955AOct 10, 2000
Encapsulating a solder joint with a photo cured epoxy resin or cyanate
IBM48 citations89
US5919596AJul 6, 1999
Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making
IBM12 citations73
US6150255ANov 21, 2000
Method of planarizing a curved substrate and resulting structure
IBM11 citations72
US6730409B1May 4, 2004
Promoting adhesion between a polymer and a metallic substrate
IBM2 citations60
US5872337AFeb 16, 1999
Chip carrier and cable assembly reinforced at edges
IBM0 citations38