Inventor
DEENEY JEFFREY L
US13 patents
⚠️ This page may combine multiple inventors who share the name “DEENEY JEFFREY L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
8 patentsUS6549418B1Apr 15, 2003
Land grid array integrated circuit device module
HEWLETT PACKARD DEVELOPMENT CO46 citations92
US6882536B2Apr 19, 2005
Wrap-around cooling arrangement for printed circuit board
HEWLETT PACKARD DEVELOPMENT CO34 citations91
US6791184B2Sep 14, 2004
Support assembly for an integrated circuit package having solder columns
HEWLETT PACKARD DEVELOPMENT CO13 citations81
US6600661B1Jul 29, 2003
Method and apparatus for supporting a circuit component
HEWLETT PACKARD DEVELOPMENT CO12 citations73
US6813162B2Nov 2, 2004
Method and apparatus for supporting circuit component having solder column array interconnects using interposed support shims
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US6710264B2Mar 23, 2004
Method and apparatus for supporting a circuit component having solder column interconnects using external support
HEWLETT PACKARD DEVELOPMENT CO2 citations60
US7273386B2Sep 25, 2007
Pin shroud
HEWLETT PACKARD DEVELOPMENT CO2 citations54
US7434309B2Oct 14, 2008
Method and apparatus for supporting a circuit component having solder column interconnects using an external support
HEWLETT PACKARD DEVELOPMENT CO1 citations49
HEWLETT PACKARD CO
4 patentsUS5783862AJul 21, 1998
Electrically conductive thermal interface
HEWLETT PACKARD CO95 citations97
US6477058B1Nov 5, 2002
Integrated circuit device package including multiple stacked components
HEWLETT PACKARD CO138 citations94
US6541710B1Apr 1, 2003
Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columns
HEWLETT PACKARD CO8 citations73
US5521425AMay 28, 1996
Tape automated bonded (TAB) circuit
HEWLETT PACKARD CO16 citations73