P

Inventor

PENDSE RAJENDRA

US4 patents
⚠️ This page may combine multiple inventors who share the name “PENDSE RAJENDRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIPPAC INC

3 patents
US6940178B2Sep 6, 2005

Self-coplanarity bumping shape for flip chip

CHIPPAC INC51 citations95
US6780682B2Aug 24, 2004

Process for precise encapsulation of flip chip interconnects

CHIPPAC INC42 citations89
US6737295B2May 18, 2004

Chip scale package with flip chip interconnect

CHIPPAC INC34 citations89

QUALCOMM INC

1 patent
US10002857B2Jun 19, 2018

Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer

QUALCOMM INC10 citations79