P

Inventor

AHN TAE-HYUK

KR36 patents
⚠️ This page may combine multiple inventors who share the name “AHN TAE-HYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

33 patents
US6617253B1Sep 9, 2003

Plasma etching method using polymer deposition and method of forming contact hole using the plasma etching method

SAMSUNG ELECTRONICS CO LTD465 citations99
US6461911B2Oct 8, 2002

Semiconductor memory device and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD129 citations98
US7053435B2May 30, 2006

Electronic devices including electrodes with insulating spacers thereon

SAMSUNG ELECTRONICS CO LTD57 citations95
US6885052B2Apr 26, 2005

Semiconductor memory device having self-aligned contacts and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD17 citations92
US6573551B1Jun 3, 2003

Semiconductor memory device having self-aligned contact and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD23 citations92
US6573602B2Jun 3, 2003

Semiconductor device with a self-aligned contact and a method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD30 citations92
US5491103AFeb 13, 1996

Method for manufacturing a capacitor structure of a semiconductor memory device

SAMSUNG ELECTRONICS CO LTD44 citations92
US5087857AFeb 11, 1992

Plasma generating apparatus and method using modulation system

SAMSUNG ELECTRONICS CO LTD46 citations92
US7534726B2May 19, 2009

Method of forming a recess channel trench pattern, and fabricating a recess channel transistor

SAMSUNG ELECTRONICS CO LTD8 citations84
US7511328B2Mar 31, 2009

Semiconductor device having raised cell landing pad and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD13 citations84
US7205199B2Apr 17, 2007

Method of forming a recess channel trench pattern, and fabricating a recess channel transistor

SAMSUNG ELECTRONICS CO LTD10 citations84
US6719808B1Apr 13, 2004

Method of and apparatus for manufacturing a semiconductor device using a polysilicon hard mask

SAMSUNG ELECTRONICS CO LTD15 citations84
US6461975B1Oct 8, 2002

Method of etching insulating layer in semiconductor device

SAMSUNG ELECTRONICS CO LTD16 citations84
US6653228B2Nov 25, 2003

Method for preparing semiconductor including formation of contact hole using difluoromethane gas

SAMSUNG ELECTRONICS CO LTD14 citations83
US7326619B2Feb 5, 2008

Method of manufacturing integrated circuit device including recessed channel transistor

SAMSUNG ELECTRONICS CO LTD10 citations82
US6690093B2Feb 10, 2004

Metal contact structure in semiconductor device and method for forming the same

SAMSUNG ELECTRONICS CO LTD7 citations74
US7314795B2Jan 1, 2008

Methods of forming electronic devices including electrodes with insulating spacers thereon

SAMSUNG ELECTRONICS CO LTD8 citations73
US7132708B2Nov 7, 2006

Semiconductor memory device having self-aligned contacts and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD6 citations73
US6451663B1Sep 17, 2002

Method of manufacturing a cylindrical storage node in a semiconductor device

SAMSUNG ELECTRONICS CO LTD11 citations73
US7851354B2Dec 14, 2010

Semiconductor memory device having local etch stopper and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD6 citations72
US6777341B2Aug 17, 2004

Method of forming a self-aligned contact, and method of fabricating a semiconductor device having a self-aligned contact

SAMSUNG ELECTRONICS CO LTD5 citations63
US7888725B2Feb 15, 2011

Electronic devices including electrode walls with insulating layers thereon

SAMSUNG ELECTRONICS CO LTD1 citations62
US7531414B2May 12, 2009

Method of manufacturing integrated circuit device including recessed channel transistor

SAMSUNG ELECTRONICS CO LTD4 citations61
US7462899B2Dec 9, 2008

Semiconductor memory device having local etch stopper and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD5 citations61
US8017485B2Sep 13, 2011

Methods of fabricating a semiconductor device

SAMSUNG ELECTRONICS CO LTD4 citations60
US7682778B2Mar 23, 2010

Methods of forming contact plugs in semiconductor devices

SAMSUNG ELECTRONICS CO LTD1 citations52
US7312121B2Dec 25, 2007

Method of manufacturing a semiconductor memory device

SAMSUNG ELECTRONICS CO LTD0 citations52
US6927127B2Aug 9, 2005

Method of manufacturing a semiconductor memory device

SAMSUNG ELECTRONICS CO LTD0 citations52
US6784097B2Aug 31, 2004

Method of manufacturing a semiconductor device with a self-aligned contact

SAMSUNG ELECTRONICS CO LTD0 citations52
US6682975B2Jan 27, 2004

Semiconductor memory device having self-aligned contact and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD0 citations52
US7491601B2Feb 17, 2009

Methods of forming electronic devices including electrodes with insulating spacers thereon

SAMSUNG ELECTRONICS CO LTD0 citations51
US7491344B2Feb 17, 2009

Method for etching an object using a plasma and an object etched by a plasma

SAMSUNG ELECTRONICS CO LTD1 citations51
US7074725B2Jul 11, 2006

Method for forming a storage node of a capacitor

SAMSUNG ELECTRONICS CO LTD1 citations51

BAE YONG-KUG

1 patent

SAMSUG ELECTRONICS CO LTD

1 patent

SAMSUNG SEMICONDUCTOR TELE

1 patent