Inventor
AHN TAE-HYUK
KR36 patents
⚠️ This page may combine multiple inventors who share the name “AHN TAE-HYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
33 patentsUS6617253B1Sep 9, 2003
Plasma etching method using polymer deposition and method of forming contact hole using the plasma etching method
SAMSUNG ELECTRONICS CO LTD465 citations99
US6461911B2Oct 8, 2002
Semiconductor memory device and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD129 citations98
US7053435B2May 30, 2006
Electronic devices including electrodes with insulating spacers thereon
SAMSUNG ELECTRONICS CO LTD57 citations95
US6885052B2Apr 26, 2005
Semiconductor memory device having self-aligned contacts and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD17 citations92
US6573551B1Jun 3, 2003
Semiconductor memory device having self-aligned contact and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD23 citations92
US6573602B2Jun 3, 2003
Semiconductor device with a self-aligned contact and a method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD30 citations92
US5491103AFeb 13, 1996
Method for manufacturing a capacitor structure of a semiconductor memory device
SAMSUNG ELECTRONICS CO LTD44 citations92
US5087857AFeb 11, 1992
Plasma generating apparatus and method using modulation system
SAMSUNG ELECTRONICS CO LTD46 citations92
US7534726B2May 19, 2009
Method of forming a recess channel trench pattern, and fabricating a recess channel transistor
SAMSUNG ELECTRONICS CO LTD8 citations84
US7511328B2Mar 31, 2009
Semiconductor device having raised cell landing pad and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD13 citations84
US7205199B2Apr 17, 2007
Method of forming a recess channel trench pattern, and fabricating a recess channel transistor
SAMSUNG ELECTRONICS CO LTD10 citations84
US6719808B1Apr 13, 2004
Method of and apparatus for manufacturing a semiconductor device using a polysilicon hard mask
SAMSUNG ELECTRONICS CO LTD15 citations84
US6461975B1Oct 8, 2002
Method of etching insulating layer in semiconductor device
SAMSUNG ELECTRONICS CO LTD16 citations84
US6653228B2Nov 25, 2003
Method for preparing semiconductor including formation of contact hole using difluoromethane gas
SAMSUNG ELECTRONICS CO LTD14 citations83
US7326619B2Feb 5, 2008
Method of manufacturing integrated circuit device including recessed channel transistor
SAMSUNG ELECTRONICS CO LTD10 citations82
US6690093B2Feb 10, 2004
Metal contact structure in semiconductor device and method for forming the same
SAMSUNG ELECTRONICS CO LTD7 citations74
US7314795B2Jan 1, 2008
Methods of forming electronic devices including electrodes with insulating spacers thereon
SAMSUNG ELECTRONICS CO LTD8 citations73
US7132708B2Nov 7, 2006
Semiconductor memory device having self-aligned contacts and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US6451663B1Sep 17, 2002
Method of manufacturing a cylindrical storage node in a semiconductor device
SAMSUNG ELECTRONICS CO LTD11 citations73
US7851354B2Dec 14, 2010
Semiconductor memory device having local etch stopper and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations72
US6777341B2Aug 17, 2004
Method of forming a self-aligned contact, and method of fabricating a semiconductor device having a self-aligned contact
SAMSUNG ELECTRONICS CO LTD5 citations63
US7888725B2Feb 15, 2011
Electronic devices including electrode walls with insulating layers thereon
SAMSUNG ELECTRONICS CO LTD1 citations62
US7531414B2May 12, 2009
Method of manufacturing integrated circuit device including recessed channel transistor
SAMSUNG ELECTRONICS CO LTD4 citations61
US7462899B2Dec 9, 2008
Semiconductor memory device having local etch stopper and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations61
US8017485B2Sep 13, 2011
Methods of fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations60
US7682778B2Mar 23, 2010
Methods of forming contact plugs in semiconductor devices
SAMSUNG ELECTRONICS CO LTD1 citations52
US7312121B2Dec 25, 2007
Method of manufacturing a semiconductor memory device
SAMSUNG ELECTRONICS CO LTD0 citations52
US6927127B2Aug 9, 2005
Method of manufacturing a semiconductor memory device
SAMSUNG ELECTRONICS CO LTD0 citations52
US6784097B2Aug 31, 2004
Method of manufacturing a semiconductor device with a self-aligned contact
SAMSUNG ELECTRONICS CO LTD0 citations52
US6682975B2Jan 27, 2004
Semiconductor memory device having self-aligned contact and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD0 citations52
US7491601B2Feb 17, 2009
Methods of forming electronic devices including electrodes with insulating spacers thereon
SAMSUNG ELECTRONICS CO LTD0 citations51
US7491344B2Feb 17, 2009
Method for etching an object using a plasma and an object etched by a plasma
SAMSUNG ELECTRONICS CO LTD1 citations51
US7074725B2Jul 11, 2006
Method for forming a storage node of a capacitor
SAMSUNG ELECTRONICS CO LTD1 citations51