Inventor
BONITZ BARRY A
US4 patents
Patents
4 patentsUS5414928AMay 16, 1995
Method of making an electronic package assembly with protective encapsulant material
IBM21 citations89
US6984286B2Jan 10, 2006
Adjusting fillet geometry to couple a heat spreader to a chip carrier
IBM6 citations72
US6545869B2Apr 8, 2003
Adjusting fillet geometry to couple a heat spreader to a chip carrier
IBM8 citations72
US7094966B2Aug 22, 2006
Packaging integrated circuits with adhesive posts
IBM5 citations61