Inventor
LO KUANG-LIN
TW10 patents
⚠️ This page may combine multiple inventors who share the name “LO KUANG-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
9 patentsUS6118176ASep 12, 2000
Stacked chip assembly utilizing a lead frame
ADVANCED SEMICONDUCTOR ENG153 citations96
US7473629B2Jan 6, 2009
Substrate structure having a solder mask and a process for making the same
ADVANCED SEMICONDUCTOR ENG30 citations91
US6163076ADec 19, 2000
Stacked structure of semiconductor package
ADVANCED SEMICONDUCTOR ENG35 citations88
US6093960AJul 25, 2000
Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance
ADVANCED SEMICONDUCTOR ENG43 citations88
US7384566B2Jun 10, 2008
Fabrication method for printed circuit board
ADVANCED SEMICONDUCTOR ENG7 citations72
US6627481B2Sep 30, 2003
Method of manufacturing a semiconductor package with a lead frame having a support structure
ADVANCED SEMICONDUCTOR ENG7 citations68
US7144239B2Dec 5, 2006
Molding apparatus with a molding flowability sensor for packaging semiconductor device
ADVANCED SEMICONDUCTOR ENG0 citations49
US6942478B2Sep 13, 2005
Packaging mold with electrostatic discharge protection
ADVANCED SEMICONDUCTOR ENG1 citations47
US6777793B2Aug 17, 2004
Packaging substrate with electrostatic discharge protection
ADVANCED SEMICONDUCTOR ENG0 citations36