Inventor

HUI PAUL

US6 patents

⚠️ This page may combine multiple inventors who share the name “HUI PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

2 patents

US6930027B2Aug 16, 2005

Method of manufacturing a semiconductor component

FREESCALE SEMICONDUCTOR INC17 citations82

US7820519B2Oct 26, 2010

Process of forming an electronic device including a conductive structure extending through a buried insulating layer

FREESCALE SEMICONDUCTOR INC5 citations59

GEN MOTORS OF CANADA LTD

2 patents

US6945592B1Sep 20, 2005

Sealer tape and clip assembly

GEN MOTORS OF CANADA LTD12 citations79

US7045189B2May 16, 2006

Molding for automotive application

GEN MOTORS OF CANADA LTD19 citations78

MOTOROLA INC

1 patent

US6734524B1May 11, 2004

Electronic component and method of manufacturing same

MOTOROLA INC21 citations91

ROGGENBAUER TODD C

1 patent

US8188543B2May 29, 2012

Electronic device including a conductive structure extending through a buried insulating layer

ROGGENBAUER TODD C12 citations78