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Inventor
HUANG XIAOQIU
US
5 patents
⚠️ This page may combine multiple inventors who share the name “HUANG XIAOQIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AUSTRIA AG
2 patents
US11545545B2
Jan 3, 2023
Superjunction device with oxygen inserted Si-layers
INFINEON TECHNOLOGIES AUSTRIA AG
0 citations
62
US10790353B2
Sep 29, 2020
Semiconductor device with superjunction and oxygen inserted Si-layers
INFINEON TECHNOLOGIES AUSTRIA AG
0 citations
51
FREESCALE SEMICONDUCTOR INC
2 patents
US7820519B2
Oct 26, 2010
Process of forming an electronic device including a conductive structure extending through a buried insulating layer
FREESCALE SEMICONDUCTOR INC
5 citations
59
US7645651B2
Jan 12, 2010
LDMOS with channel stress
FREESCALE SEMICONDUCTOR INC
5 citations
59
ROGGENBAUER TODD C
1 patent
US8188543B2
May 29, 2012
Electronic device including a conductive structure extending through a buried insulating layer
ROGGENBAUER TODD C
12 citations
78