Inventor
MASUMOTO MUTSUMI
JP37 patents
⚠️ This page may combine multiple inventors who share the name “MASUMOTO MUTSUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
29 patentsUS7847399B2Dec 7, 2010
Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles
TEXAS INSTRUMENTS INC64 citations98
US6759745B2Jul 6, 2004
Semiconductor device and manufacturing method thereof
TEXAS INSTRUMENTS INC56 citations96
US6482730B1Nov 19, 2002
Method for manufacturing a semiconductor device
TEXAS INSTRUMENTS INC67 citations96
US6780749B2Aug 24, 2004
Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges
TEXAS INSTRUMENTS INC63 citations95
US7947602B2May 24, 2011
Conductive pattern formation method
TEXAS INSTRUMENTS INC61 citations92
US6734532B2May 11, 2004
Back side coating of semiconductor wafers
TEXAS INSTRUMENTS INC22 citations92
US6583483B2Jun 24, 2003
Semiconductor device and its manufacturing method
TEXAS INSTRUMENTS INC18 citations92
US6269999B1Aug 7, 2001
Semiconductor chip mounting method utilizing ultrasonic vibrations
TEXAS INSTRUMENTS INC41 citations91
US6830956B2Dec 14, 2004
Method for packaging a low profile semiconductor device
TEXAS INSTRUMENTS INC17 citations84
US6887778B2May 3, 2005
Semiconductor device and manufacturing method
TEXAS INSTRUMENTS INC12 citations83
US6929971B2Aug 16, 2005
Semiconductor device and its manufacturing method
TEXAS INSTRUMENTS INC7 citations73
US6525424B2Feb 25, 2003
Semiconductor device and its manufacturing method
TEXAS INSTRUMENTS INC10 citations73
US6716674B2Apr 6, 2004
Method of forming a semiconductor package
TEXAS INSTRUMENTS INC10 citations70
US7521291B2Apr 21, 2009
Method for manufacturing a semiconductor device
TEXAS INSTRUMENTS INC4 citations63
US7459339B2Dec 2, 2008
Flip-chip semiconductor device manufacturing method
TEXAS INSTRUMENTS INC6 citations63
US12125799B2Oct 22, 2024
Embedded die packaging with integrated ceramic substrate
TEXAS INSTRUMENTS INC0 citations62
US11183460B2Nov 23, 2021
Embedded die packaging with integrated ceramic substrate
TEXAS INSTRUMENTS INC0 citations62
US6876077B2Apr 5, 2005
Semiconductor device and its manufacturing method
TEXAS INSTRUMENTS INC2 citations62
US11183441B2Nov 23, 2021
Stress buffer layer in embedded package
TEXAS INSTRUMENTS INC0 citations61
US11158595B2Oct 26, 2021
Embedded die package multichip module
TEXAS INSTRUMENTS INC0 citations61
US10580715B2Mar 3, 2020
Stress buffer layer in embedded package
TEXAS INSTRUMENTS INC1 citations61
US12154861B2Nov 26, 2024
Frame design in embedded die package
TEXAS INSTRUMENTS INC0 citations59
US6969919B2Nov 29, 2005
Semiconductor package production method and semiconductor package
TEXAS INSTRUMENTS INC1 citations59
US6774496B2Aug 10, 2004
Semiconductor package with a thermoset bond
TEXAS INSTRUMENTS INC2 citations59
US8381967B1Feb 26, 2013
Bonding a solder bump to a lead using compression and retraction forces
TEXAS INSTRUMENTS INC3 citations56
US7851264B2Dec 14, 2010
Semiconductor device singulation method
TEXAS INSTRUMENTS INC1 citations52
US11410875B2Aug 9, 2022
Fan-out electronic device
TEXAS INSTRUMENTS INC0 citations51
US11923320B2Mar 5, 2024
Semiconductor device having tapered metal coated sidewalls
TEXAS INSTRUMENTS INC0 citations50
US7754528B2Jul 13, 2010
Method for thin semiconductor packages
TEXAS INSTRUMENTS INC0 citations42