Inventor · disambiguated record
Makoto Tsunekawa
Also filed as: TSUNEKAWA MAKOTO
8 granted patents·8 pending applications·97 citations·filing 1998–2022
85Inventor score
Top patents by PatentIndex Score
16 records- 0174US6223594B1Thermal type air flow amount measuring apparatus having flow rectifierDENSO CORP·Filed 1998·Granted May 1, 2001·38 cites·20 claims
- 0270US8893648B2Electroless plating apparatus, method of electroless plating, and manufacturing method of printed circuit boardTSUNEKAWA MAKOTO·Filed 2012·Granted Nov 25, 2014·4 cites·4 claims
- 0369US6220090B1Air flow meterDENSO CORP·Filed 1999·Granted Apr 24, 2001·33 cites·6 claims
- 0467US6938473B2Apparatus for measuring flow amountDENSO CORP·Filed 2002·Granted Sep 6, 2005·17 cites·32 claims
- 0560US7798062B2Printing apparatus and printing methodNITTO DENKO CORP·Filed 2007·Granted Sep 21, 2010·2 cites·7 claims
- 0659US8037597B2Manufacturing method of tape carrier for TABNITTO DENKO CORP·Filed 2008·Granted Oct 18, 2011·2 cites·5 claims
- 0756US8378226B2Wired circuit boardNITTO DENKO CORP·Filed 2008·Granted Feb 19, 2013·1 cites·1 claims
- 0849US2024224435A1Method for producing wiring circuit boardNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0948US2024373564A1Assembly sheet and method for producing assembly sheetNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1048US2024215155A1Assembly sheet and method for producing assembly sheetNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1148US2024237200A1Assembly sheet and method for producing assembly sheetNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1247US7678608B2Process for producing wiring circuit boardNITTO DENKO CORP·Filed 2006·Granted Mar 16, 2010·0 cites·6 claims
- 1344US2012295013A1Electroless plating apparatus, method of electroless plating, and manufacturing method of printed circuit boardTSUNEKAWA MAKOTO·Filed 2012·Application pending·0 cites
- 1436US2012147491A1Reflective Film and Method of Manufacturing the SameTSUNEKAWA MAKOTO·Filed 2011·Application pending·0 cites
- 1535US2016014905A1Laminate for electrode pattern production, production method thereof, touch panel substrate, and image display deviceNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 1634US2005244620A1Wired circuit board and production method thereofNITTO DENKO CORP·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →