Inventor
CHEN CHIEN-HUI
TW36 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIEN-HUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
16 patentsUS8963312B2Feb 24, 2015
Stacked chip package and method for forming the same
XINTEC INC11 citations84
US8952501B2Feb 10, 2015
Chip package and method for forming the same
XINTEC INC14 citations83
US9355975B2May 31, 2016
Chip package and method for forming the same
XINTEC INC6 citations73
US9349710B2May 24, 2016
Chip package and method for forming the same
XINTEC INC2 citations63
US9437478B2Sep 6, 2016
Chip package and method for forming the same
XINTEC INC2 citations62
US9425134B2Aug 23, 2016
Chip package
XINTEC INC2 citations62
US9318461B2Apr 19, 2016
Wafer level array of chips and method thereof
XINTEC INC2 citations62
US9209124B2Dec 8, 2015
Chip package
XINTEC INC3 citations62
US9184092B2Nov 10, 2015
Chip package and method for forming the same
XINTEC INC2 citations62
US8951836B2Feb 10, 2015
Chip package and method for forming the same
XINTEC INC2 citations62
US9355970B2May 31, 2016
Chip package and method for forming the same
XINTEC INC1 citations51
US9165890B2Oct 20, 2015
Chip package comprising alignment mark and method for forming the same
XINTEC INC1 citations51
US8778707B2Jul 15, 2014
High-reflection submount for light-emitting diode package and fabrication method thereof
XINTEC INC0 citations51
US9305843B2Apr 5, 2016
Chip package and method for forming the same
XINTEC INC0 citations50
US10388541B2Aug 20, 2019
Wafer coating system and method of manufacturing chip package
XINTEC INC0 citations47
US9275963B2Mar 1, 2016
Semiconductor structure having stage difference surface and manufacturing method thereof
XINTEC INC0 citations39
YEN YU-LIN
5 patentsUS8692382B2Apr 8, 2014
Chip package
YEN YU-LIN23 citations92
US8525345B2Sep 3, 2013
Chip package and method for forming the same
YEN YU-LIN21 citations92
US9024437B2May 5, 2015
Chip package and method for forming the same
YEN YU-LIN2 citations62
US8698316B2Apr 15, 2014
Chip package
YEN YU-LIN3 citations62
US8552565B2Oct 8, 2013
Chip package and method for forming the same
YEN YU-LIN3 citations62
TAIWAN SEMICONDUCTOR MFG CO LTD
4 patentsUS12027396B2Jul 2, 2024
Systems and methods for systematic physical failure analysis (PFA) fault localization
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11600505B2Mar 7, 2023
Systems and methods for systematic physical failure analysis (PFA) fault localization
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12374572B2Jul 29, 2025
Systems and methods for systematic physical failure analysis (PFA) fault localization
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9478469B2Oct 25, 2016
Integrated circuit comprising buffer chain
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51