Inventor
LEE SANG YEOP
KR21 patents
⚠️ This page may combine multiple inventors who share the name “LEE SANG YEOP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS7227086B2Jun 5, 2007
Semiconductor chip package having an adhesive tape attached on bonding wires
SAMSUNG ELECTRONICS CO LTD21 citations90
US7005577B2Feb 28, 2006
Semiconductor chip package having an adhesive tape attached on bonding wires
SAMSUNG ELECTRONICS CO LTD11 citations81
US7067413B2Jun 27, 2006
Wire bonding method, semiconductor chip, and semiconductor package
SAMSUNG ELECTRONICS CO LTD10 citations74
US7030489B2Apr 18, 2006
Multi-chip module having bonding wires and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations73
US7495315B2Feb 24, 2009
Method and apparatus of fabricating a semiconductor device by back grinding and dicing
SAMSUNG ELECTRONICS CO LTD5 citations71
US7096914B2Aug 29, 2006
Apparatus for bonding a chip using an insulating adhesive tape
SAMSUNG ELECTRONICS CO LTD6 citations61
US7410832B2Aug 12, 2008
Semiconductor chip package having an adhesive tape attached on bonding wires
SAMSUNG ELECTRONICS CO LTD4 citations60
US7323397B2Jan 29, 2008
Method and apparatus of fabricating a semiconductor device by back grinding and dicing
SAMSUNG ELECTRONICS CO LTD3 citations60