Inventor
WOMAC DAVID J
US9 patents
⚠️ This page may combine multiple inventors who share the name “WOMAC DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
6 patentsUS6085831AJul 11, 2000
Direct chip-cooling through liquid vaporization heat exchange
IBM115 citations97
US5981310ANov 9, 1999
Multi-chip heat-sink cap assembly
IBM59 citations95
US6373133B1Apr 16, 2002
Multi-chip module and heat-sink cap combination
IBM34 citations92
US6222263B1Apr 24, 2001
Chip assembly with load-bearing lid in thermal contact with the chip
IBM24 citations91
US6333460B1Dec 25, 2001
Structural support for direct lid attach
IBM18 citations84
US6214647B1Apr 10, 2001
Method for bonding heatsink to multiple-height chip
IBM19 citations81