Inventor
CHUNG DAE HYUK
KR18 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG DAE HYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS6437411B1Aug 20, 2002
Semiconductor device having chamfered silicide layer and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD31 citations91
US6406967B1Jun 18, 2002
Method for manufacturing cylindrical storage electrode of semiconductor device
SAMSUNG ELECTRONICS CO LTD28 citations91
US6369008B1Apr 9, 2002
Cleaning solutions for removing contaminants from the surfaces of semiconductor substrates and cleaning methods using the same
SAMSUNG ELECTRONICS CO LTD17 citations82
US7573132B2Aug 11, 2009
Wiring structure of a semiconductor device and method of forming the same
SAMSUNG ELECTRONICS CO LTD7 citations73
US6875706B2Apr 5, 2005
Cleaning solution and method of cleaning a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD10 citations73
US6451663B1Sep 17, 2002
Method of manufacturing a cylindrical storage node in a semiconductor device
SAMSUNG ELECTRONICS CO LTD11 citations73
US6740550B2May 25, 2004
Methods of manufacturing semiconductor devices having chamfered silicide layers therein
SAMSUNG ELECTRONICS CO LTD12 citations72
US6706633B2Mar 16, 2004
Method of forming a self-aligned contact pad for use in a semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations62
US8962455B2Feb 24, 2015
Method of fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations60
US7405164B2Jul 29, 2008
Apparatus and method for removing a photoresist structure from a substrate
SAMSUNG ELECTRONICS CO LTD0 citations51
US6946431B2Sep 20, 2005
Cleaning solution including aqueous ammonia solution, acetic acid and deionized water for integrated circuit devices and methods of cleaning integrated circuit devices using the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US7527921B2May 5, 2009
Method of treating and removing a photoresist pattern and method of manufacturing a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD1 citations50
US7799687B2Sep 21, 2010
Slurry composition for a chemical mechanical polishing process and method of manufacturing a semiconductor device using the slurry composition
SAMSUNG ELECTRONICS CO LTD1 citations47