Inventor
KUNG CHEN-YUEH
TW22 patents
⚠️ This page may combine multiple inventors who share the name “KUNG CHEN-YUEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VIA TECH INC
13 patentsUS7087991B2Aug 8, 2006
Integrated circuit package and method of manufacture
VIA TECH INC83 citations97
US6977348B2Dec 20, 2005
High density laminated substrate structure and manufacture method thereof
VIA TECH INC54 citations96
US6779783B2Aug 24, 2004
Method and structure for tape ball grid array package
VIA TECH INC39 citations90
US9497864B2Nov 15, 2016
Circuit substrate, semiconductor package and process for fabricating the same
VIA TECH INC8 citations83
US10014246B2Jul 3, 2018
Circuit substrate, semiconductor package and process for fabricating the same
VIA TECH INC4 citations72
US10184956B2Jan 22, 2019
Probe card
VIA TECH INC1 citations62
US9425066B2Aug 23, 2016
Circuit substrate
VIA TECH INC2 citations62
US10459007B2Oct 29, 2019
Probe card
VIA TECH INC0 citations52
US10119995B2Nov 6, 2018
Probe card
VIA TECH INC0 citations52
US9324580B2Apr 26, 2016
Process for fabricating a circuit substrate
VIA TECH INC1 citations52
US10573614B2Feb 25, 2020
Process for fabricating a circuit substrate
VIA TECH INC0 citations51
US10103115B2Oct 16, 2018
Circuit substrate and semicondutor package structure
VIA TECH INC0 citations51
US9532467B2Dec 27, 2016
Circuit substrate
VIA TECH INC0 citations51
VIA ALLIANCE SEMICONDUCTOR CO LTD
5 patentsUS10204852B2Feb 12, 2019
Circuit substrate and semiconductor package structure
VIA ALLIANCE SEMICONDUCTOR CO LTD8 citations82
US9905519B1Feb 27, 2018
Electronic structure process
VIA ALLIANCE SEMICONDUCTOR CO LTD2 citations73
US9786588B2Oct 10, 2017
Circuit substrate and package structure
VIA ALLIANCE SEMICONDUCTOR CO LTD4 citations61
US10002839B2Jun 19, 2018
Electronic structure, and electronic structure array
VIA ALLIANCE SEMICONDUCTOR CO LTD0 citations52
US9601425B2Mar 21, 2017
Circuit substrate and semiconductor package structure
VIA ALLIANCE SEMICONDUCTOR CO LTD0 citations51
KUNG CHEN-YUEH
4 patentsUS9066458B2Jun 23, 2015
Fabricating method of circuit board and circuit board
KUNG CHEN-YUEH4 citations71
US8302298B2Nov 6, 2012
Process for fabricating circuit substrate
KUNG CHEN-YUEH2 citations61
US8549745B2Oct 8, 2013
Fabricating process of circuit substrate
KUNG CHEN-YUEH1 citations50
US8261436B2Sep 11, 2012
Fabricating process of circuit substrate
KUNG CHEN-YUEH1 citations50