Inventor
MIECZKOWSKI VAN
US17 patents
⚠️ This page may combine multiple inventors who share the name “MIECZKOWSKI VAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CREE INC
7 patentsUS7557380B2Jul 7, 2009
Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads
CREE INC15 citations92
US9991399B2Jun 5, 2018
Passivation structure for semiconductor devices
CREE INC11 citations84
US9998109B1Jun 12, 2018
Power module with improved reliability
CREE INC7 citations82
US9536783B2Jan 3, 2017
Wafer-level die attach metallization
CREE INC2 citations71
US7557379B2Jul 7, 2009
Light emitting devices having a roughened reflective bond pad and methods of fabricating light emitting devices having roughened reflective bond pads
CREE INC2 citations63
US10707858B2Jul 7, 2020
Power module with improved reliability
CREE INC1 citations60
US8810355B2Aug 19, 2014
Thin film resistor
CREE INC0 citations50
MIECZKOWSKI VAN
7 patentsUS9142631B2Sep 22, 2015
Multilayer diffusion barriers for wide bandgap Schottky barrier devices
MIECZKOWSKI VAN4 citations72
US8896122B2Nov 25, 2014
Semiconductor devices having gates including oxidized nickel
MIECZKOWSKI VAN4 citations72
US8907350B2Dec 9, 2014
Semiconductor devices having improved adhesion and methods of fabricating the same
MIECZKOWSKI VAN5 citations71
US9343383B2May 17, 2016
High voltage semiconductor devices including electric arc suppression material and methods of forming the same
MIECZKOWSKI VAN2 citations60
US9607955B2Mar 28, 2017
Contact pad
MIECZKOWSKI VAN0 citations50
US8570140B2Oct 29, 2013
Thin film resistor
MIECZKOWSKI VAN0 citations49
US10020244B2Jul 10, 2018
Polymer via plugs with high thermal integrity
MIECZKOWSKI VAN0 citations48