Inventor

HARADA SHIGERU

JP67 patents

⚠️ This page may combine multiple inventors who share the name “HARADA SHIGERU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HARADA SHIGERU

MITSUBISHI ELECTRIC CORP

Semiconductor device having multilayer interconnection structure

Semiconductor device and fabrication process therefor

Semiconductor device having a multilayer interconnection structure

Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion and method for fabricating the same

Process of passivating a semiconductor device bonding pad by immersion in O2 or O3 solution

Semiconductor device having a titanium and a titanium compound multilayer interconnection structure

Method of manufacturing semiconductor device having multilayer interconnection structure

Interconnection structure of semiconductor integrated circuit device

Semiconductor device having protective insulating film

Apparatus for forming a thin film

Semiconductor device and method of manufacturing thereof

Semiconductor device with bonding pad electrode

Chemical vapor deposition apparatus having cooling heads adjacent to gas dispersing heads in a single chamber

Thin film-forming apparatus

Semiconductor device having improved interconnection-wiring structures

Semiconductor device

Method and apparatus for manufacturing a semiconductor integrated circuit

Method of making a semiconductor device

Semiconductor device including silicon ladder resin layer

Interconnection structure of semiconductor integrated circuit device and manufacturing method thererfor

Method of producing semiconductor device

Semiconductor device and a method of producing same

Method of forming an interconnection structure

Semiconductor device with improved immunity to contact and conductor defects

Semiconductor device and manufacturing method thereof

Semiconductor integrated circuit interconnection structures and method of making the interconnection structures

Semiconductor integrated circuit interconnection structures

Semiconductor device whose flattening resin film component has a controlled carbon atom content

Manufacturing method for protective silicon oxynitride film

Method and apparatus for manufacturing a semiconductor integrated circuit

Method of forming a silicide film

Semiconductor device having improved antireflection coating

Semiconductor device and method of manufacturing thereof

Semiconductor device having conductive layer and manufacturing method thereof

Semiconductor device with improved immunity to contact and conductor defects

SONY CORP

Image processing apparatus, image display and image processing method

Video image display apparatus and method

Stereoscopic video display method and apparatus, stereoscopic video system, and stereoscopic video forming method

Video image display apparatus and method

Video display method and video display apparatus

Feedback clamping circuit

MITSUTA SHINJI

Work vehicle periphery monitoring apparatus

Perimeter monitoring device for work vehicle

Load display device for dump truck

Dump truck

Surrounding area monitoring device for work vehicle

KOMATSU MFG CO LTD

Dump truck with obstacle detection mechanism and method for detecting obstacle

Perimeter monitoring device for work vehicle

RENESAS TECH CORP

Multilayer interconnection structure including an alignment mark

TOSHIBA KK

Plant maintenance method and apparatus