Inventor
PAN YU-TANG
TW20 patents
⚠️ This page may combine multiple inventors who share the name “PAN YU-TANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES INC
12 patentsUS7723853B2May 25, 2010
Chip package without core and stacked chip package structure
CHIPMOS TECHNOLOGIES INC17 citations91
US7436074B2Oct 14, 2008
Chip package without core and stacked chip package structure thereof
CHIPMOS TECHNOLOGIES INC34 citations91
US7510889B2Mar 31, 2009
Light emitting chip package and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC32 citations90
US7560306B2Jul 14, 2009
Manufacturing process for chip package without core
CHIPMOS TECHNOLOGIES INC3 citations63
US8691630B2Apr 8, 2014
Semiconductor package structure and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC2 citations62
US7902649B2Mar 8, 2011
Leadframe for leadless package, structure and manufacturing method using the same
CHIPMOS TECHNOLOGIES INC3 citations62
US7514299B2Apr 7, 2009
Chip package structure and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC5 citations62
US7592694B2Sep 22, 2009
Chip package and method of manufacturing the same
CHIPMOS TECHNOLOGIES INC2 citations60
US7459783B2Dec 2, 2008
Light emitting chip package and light source module
CHIPMOS TECHNOLOGIES INC2 citations59
US9735092B2Aug 15, 2017
Manufacturing method of chip package structure
CHIPMOS TECHNOLOGIES INC0 citations51
US9437529B2Sep 6, 2016
Chip package structure and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC0 citations51
US7605461B2Oct 20, 2009
Chip package structure
CHIPMOS TECHNOLOGIES INC0 citations41