P

Inventor

WU CHENG-TING

TW10 patents
⚠️ This page may combine multiple inventors who share the name “WU CHENG-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIPMOS TECHNOLOGIES INC

5 patents
US7723853B2May 25, 2010

Chip package without core and stacked chip package structure

CHIPMOS TECHNOLOGIES INC17 citations91
US7436074B2Oct 14, 2008

Chip package without core and stacked chip package structure thereof

CHIPMOS TECHNOLOGIES INC34 citations91
US7939950B2May 10, 2011

Chip package structure

CHIPMOS TECHNOLOGIES INC5 citations56
US8026615B2Sep 27, 2011

IC package reducing wiring layers on substrate and its carrier

CHIPMOS TECHNOLOGIES INC0 citations50
US7781898B2Aug 24, 2010

IC package reducing wiring layers on substrate and its chip carrier

CHIPMOS TECHNOLOGIES INC0 citations50

SOLTEAM OPTO INC

2 patents
US10408739B2Sep 10, 2019

Water quality sensor suitable for automated production

SOLTEAM OPTO INC0 citations37
US10365205B1Jul 30, 2019

Water quality sensor

SOLTEAM OPTO INC0 citations37

MEDIATEK INC

1 patent
US7885357B1Feb 8, 2011

Apparatus for signal detection to enhance performance of a receiver and method therefor

MEDIATEK INC4 citations60

MEDIA TEK INC

1 patent
US7512453B2Mar 31, 2009

Data processing system and method suitable for audio data synthesis

MEDIA TEK INC2 citations58

CHIPMOS TECHNOLOGIES

1 patent
US7919874B2Apr 5, 2011

Chip package without core and stacked chip package structure

CHIPMOS TECHNOLOGIES0 citations45