Inventor
CHOU SHIH-WEN
TW29 patents
⚠️ This page may combine multiple inventors who share the name “CHOU SHIH-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES INC
17 patentsUS7723853B2May 25, 2010
Chip package without core and stacked chip package structure
CHIPMOS TECHNOLOGIES INC17 citations91
US7436074B2Oct 14, 2008
Chip package without core and stacked chip package structure thereof
CHIPMOS TECHNOLOGIES INC34 citations91
US7510889B2Mar 31, 2009
Light emitting chip package and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC32 citations90
US9728479B2Aug 8, 2017
Multi-chip package structure, wafer level chip package structure and manufacturing process thereof
CHIPMOS TECHNOLOGIES INC9 citations84
US10002815B2Jun 19, 2018
Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process
CHIPMOS TECHNOLOGIES INC2 citations73
US9653429B2May 16, 2017
Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof
CHIPMOS TECHNOLOGIES INC2 citations73
US9053968B2Jun 9, 2015
Semiconductor package structure and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC2 citations62
US8691630B2Apr 8, 2014
Semiconductor package structure and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC2 citations62
US7902649B2Mar 8, 2011
Leadframe for leadless package, structure and manufacturing method using the same
CHIPMOS TECHNOLOGIES INC3 citations62
US7851896B2Dec 14, 2010
Quad flat non-leaded chip package
CHIPMOS TECHNOLOGIES INC4 citations62
US7514299B2Apr 7, 2009
Chip package structure and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC5 citations62
US7592694B2Sep 22, 2009
Chip package and method of manufacturing the same
CHIPMOS TECHNOLOGIES INC2 citations60
US9953960B2Apr 24, 2018
Manufacturing process of wafer level chip package structure having block structure
CHIPMOS TECHNOLOGIES INC0 citations52
US7843054B2Nov 30, 2010
Chip package and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC0 citations52
US9735092B2Aug 15, 2017
Manufacturing method of chip package structure
CHIPMOS TECHNOLOGIES INC0 citations51
US9437529B2Sep 6, 2016
Chip package structure and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC0 citations51
US7605461B2Oct 20, 2009
Chip package structure
CHIPMOS TECHNOLOGIES INC0 citations41