Inventor
NIU CHENGYU
US11 patents
⚠️ This page may combine multiple inventors who share the name “NIU CHENGYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS INC
4 patentsUS8729702B1May 20, 2014
Copper seed layer for an interconnect structure having a doping concentration level gradient
ST MICROELECTRONICS INC13 citations83
US10553497B2Feb 4, 2020
Methods and devices for enhancing mobility of charge carriers
ST MICROELECTRONICS INC0 citations51
US10546789B2Jan 28, 2020
Methods of forming metal-gate semiconductor devices with enhanced mobility of charge carriers
ST MICROELECTRONICS INC0 citations51
US10438856B2Oct 8, 2019
Methods and devices for enhancing mobility of charge carriers
ST MICROELECTRONICS INC0 citations51
GLOBALFOUNDRIES INC
3 patentsUS10283608B2May 7, 2019
Low resistance contacts to source or drain region of transistor
GLOBALFOUNDRIES INC4 citations68
US10026693B2Jul 17, 2018
Method, apparatus, and system for MOL interconnects without titanium liner
GLOBALFOUNDRIES INC0 citations51
US9679807B1Jun 13, 2017
Method, apparatus, and system for MOL interconnects without titanium liner
GLOBALFOUNDRIES INC0 citations51