Inventor

CHUNG CHEE-KEY

TW26 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG CHEE-KEY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG CHEE-KEY

SILICONWARE PRECISION INDUSTRIES CO LTD

Method for fabricating electronic package

Electronic package and manufacturing method thereof

Electronic package and fabrication method thereof

Electronic package carrier structure thereof, and method for fabricating the carrier structure

Electronic package and method for fabricating the same

Electronic package and method for fabricating the same

Electronic package

Substrate construction and electronic package including the same

Electronic package and fabrication method thereof

Electronic package and fabrication method thereof

Electronic package and fabrication method thereof

Method for fabricating carrier structure

Electronic package, manufacturing method thereof and conductive structure

Method for fabricating electronic package

Electronic package, method for fabricating the same, and heat dissipator

Method for fabricating electronic package

Electronic package

Method for manufacturing electronic package

Method for manufacturing electronic package

Electronic package and method for fabricating the same

INTEL CORP

Organic-inorganic hybrid structure for integrated circuit packages

Solder interface locking using unidirectional growth of an intermetallic compound

Substrate warpage control using temper glass with uni-directional heating

Stitched micro-via to enhance adhesion and mechanical strength

Stitched micro-via to enhance adhesion and mechanical strength

Stacked die package with stud spacers