Inventor
KIM SUNCHUL
KR15 patents
⚠️ This page may combine multiple inventors who share the name “KIM SUNCHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS10825774B2Nov 3, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD7 citations82
US10475749B2Nov 12, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD13 citations82
US10622340B2Apr 14, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD9 citations81
US11309228B2Apr 19, 2022
Packaged semiconductor devices having enhanced thermal transport and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US10510672B2Dec 17, 2019
Semiconductor packages and methods of manufacturing same
SAMSUNG ELECTRONICS CO LTD6 citations71
US11133296B2Sep 28, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations70
US12406934B2Sep 2, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11515262B2Nov 29, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11437326B2Sep 6, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11557574B2Jan 17, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11075189B2Jul 27, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12557712B2Feb 17, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11482507B2Oct 25, 2022
Semiconductor package having molding member and heat dissipation member
SAMSUNG ELECTRONICS CO LTD0 citations50
US11257786B2Feb 22, 2022
Semiconductor package including molding member, heat dissipation member, and reinforcing member
SAMSUNG ELECTRONICS CO LTD0 citations50