Inventor
SINGH AKSHAY N
US14 patents
Patents
14 patentsUS10529592B2Jan 7, 2020
Semiconductor device assembly with pillar array
MICRON TECHNOLOGY INC7 citations83
US10522507B2Dec 31, 2019
Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
MICRON TECHNOLOGY INC6 citations83
US10312219B2Jun 4, 2019
Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
MICRON TECHNOLOGY INC5 citations83
US11088114B2Aug 10, 2021
High density pillar interconnect conversion with stack to substrate connection
MICRON TECHNOLOGY INC1 citations72
US12424590B2Sep 23, 2025
Semiconductor device assemblies and associated methods
MICRON TECHNOLOGY INC0 citations62
US12191162B2Jan 7, 2025
Semiconductor device assembly with pillar array
MICRON TECHNOLOGY INC0 citations62
US11973062B2Apr 30, 2024
High density pillar interconnect conversion with stack to substrate connection
MICRON TECHNOLOGY INC0 citations62
US11631644B2Apr 18, 2023
High density pillar interconnect conversion with stack to substrate connection
MICRON TECHNOLOGY INC0 citations62
US11587912B2Feb 21, 2023
High density pillar interconnect conversion with stack to substrate connection
MICRON TECHNOLOGY INC0 citations62
US11094670B2Aug 17, 2021
Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
MICRON TECHNOLOGY INC0 citations62
US10998271B1May 4, 2021
High density pillar interconnect conversion with stack to substrate connection
MICRON TECHNOLOGY INC0 citations62
US10943794B2Mar 9, 2021
Semiconductor device assembly with pillar array and test ability
MICRON TECHNOLOGY INC0 citations62
US12255163B2Mar 18, 2025
Bond pads for semiconductor die assemblies and associated methods and systems
MICRON TECHNOLOGY INC0 citations52
US12278202B2Apr 15, 2025
Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods
MICRON TECHNOLOGY INC0 citations47