Inventor

HUANG CHIH-YI

TW20 patents

⚠️ This page may combine multiple inventors who share the name “HUANG CHIH-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG CHIH-YI

ADVANCED SEMICONDUCTOR ENG

Stacked semiconductor package assemblies including double sided redistribution layers

Semiconductor package structure and method for manufacturing the same

Semiconductor device package and a method of manufacturing the same

Electronic device package and method of manufacturing the same

Package structure and testing method

Package structure and testing method

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Wiring package and method of manufacturing the same

Assembly structure and method for manufacturing the same

Semiconductor device package and method of making the same

Semiconductor package having redistribution layer

Semiconductor structure and semiconductor manufacturing method

Electronic device package and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Signal transmission structure, package structure and bonding method thereof

ORANGETEK CORP

Optical lens, mold for optical lens and manufacturing method thereof

CHENG HUNG-HSIANG

Circuit substrate having power/ground plane with grid holes

HUANG CHIH-YI

Method of making semiconductor package having redistribution layer