Inventor

JEONG JIN WON

KR18 patents

⚠️ This page may combine multiple inventors who share the name “JEONG JIN WON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JEONG JIN WON

MAGNACHIP SEMICONDUCTOR LTD

Method of forming and packaging semiconductor die

Semiconductor package with inner lead pattern group and method for manufacturing the semiconductor package

Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die

Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die

Method for forming semiconductor die with die region and seal-ring region

Semiconductor package and method of manufacturing semiconductor package

Semiconductor die forming and packaging method using ultrashort pulse laser micromachining

Test socket of flexible semiconductor chip package and bending test method using the same

SAMSUNG ELECTRONICS CO LTD

Semiconductor device including contact pads

Methods of fabricating semiconductor devices

Semiconductor device having DC structure

Semiconductor device

COUPANG CORP

Systems and methods for electronic monitoring of inventory transfer

Systems and methods for electronic monitoring of inventory transfer

Electronic apparatus and operation method thereof

KIM KEUNNAM

Semiconductor devices

JEONG JIN-WON

Semiconductor device and method of fabricating the same

UNIV INDUSTRY FOUNDATION YONSEI UNIV WONJU CAMPUS

Pickering emulsion composition using polyimide particles and preparation method thereof