Inventor
LEE KI DON
KR17 patents
⚠️ This page may combine multiple inventors who share the name “LEE KI DON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DOOSAN ENERBILITY CO LTD
5 patentsUS11965428B1Apr 23, 2024
Airfoil cooling structure, airfoil having airfoil cooling structure, and turbine blade/vane element including airfoil
DOOSAN ENERBILITY CO LTD1 citations60
US12571319B2Mar 10, 2026
Turbine component having air-jet cooling structure, and gas turbine including same
DOOSAN ENERBILITY CO LTD0 citations57
US11448074B2Sep 20, 2022
Turbine airfoil and turbine including same
DOOSAN ENERBILITY CO LTD0 citations56
US12410717B2Sep 9, 2025
Gas turbine blade with cooling flow paths and gas turbine including the same
DOOSAN ENERBILITY CO LTD0 citations50
US12140044B2Nov 12, 2024
Blade with improved cooling performance and gas turbine having the same
DOOSAN ENERBILITY CO LTD0 citations50
TEXAS INSTRUMENTS INC
4 patentsUS8865542B2Oct 21, 2014
Embedded polysilicon resistor in integrated circuits formed by a replacement gate process
TEXAS INSTRUMENTS INC9 citations84
US9240404B2Jan 19, 2016
Embedded polysilicon resistor in integrated circuits formed by a replacement gate process
TEXAS INSTRUMENTS INC2 citations62
US7566652B2Jul 28, 2009
Electrically inactive via for electromigration reliability improvement
TEXAS INSTRUMENTS INC3 citations56
US7031163B2Apr 18, 2006
Mechanical cooling fin for interconnects
TEXAS INSTRUMENTS INC1 citations51
UNIV TEXAS
2 patentsDOOSAN HEAVY IND & CONSTRUCTION CO LTD
2 patentsSAMSUNG ELECTRONICS CO LTD
2 patentsUS10211093B2Feb 19, 2019
Interconnect structure formed with a high aspect ratio single damascene copper line on a non-damascene via
SAMSUNG ELECTRONICS CO LTD0 citations45
US10930571B2Feb 23, 2021
Test structure and evaluation method for semiconductor photo overlay
SAMSUNG ELECTRONICS CO LTD0 citations41