Inventor
WU SHIH-HSIEN
TW29 patents
⚠️ This page may combine multiple inventors who share the name “WU SHIH-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
24 patentsUS7633154B2Dec 15, 2009
Encapsulation and methods thereof
IND TECH RES INST53 citations97
US9125304B2Sep 1, 2015
Circuit board having via and manufacturing method thereof
IND TECH RES INST11 citations84
US8035951B2Oct 11, 2011
Capacitor devices
IND TECH RES INST13 citations84
US7804678B2Sep 28, 2010
Capacitor devices
IND TECH RES INST9 citations84
US7742276B2Jun 22, 2010
Wiring structure of laminated capacitors
IND TECH RES INST12 citations83
US9706656B2Jul 11, 2017
Signal transmission board and method for manufacturing the same
IND TECH RES INST9 citations82
US7894172B2Feb 22, 2011
ESD protection structure
IND TECH RES INST14 citations82
US10448501B2Oct 15, 2019
Circuit structure
IND TECH RES INST5 citations73
US7349196B2Mar 25, 2008
Composite distributed dielectric structure
IND TECH RES INST8 citations73
US10405418B2Sep 3, 2019
Differential signal transmitting circuit board
IND TECH RES INST2 citations72
US7649723B2Jan 19, 2010
ESD protection substrate and integrated circuit utilizing the same
IND TECH RES INST7 citations71
US9013892B2Apr 21, 2015
Chip stacking structure
IND TECH RES INST4 citations65
US10276908B2Apr 30, 2019
Electromagnetic wave transmission board and differential electromagnetic wave transmission board
IND TECH RES INST1 citations62
US7893359B2Feb 22, 2011
Embedded capacitor core having a multiple-layer structure
IND TECH RES INST2 citations62
US11756865B2Sep 12, 2023
Electronic device having substrate
IND TECH RES INST0 citations59
US9258883B2Feb 9, 2016
Via structure
IND TECH RES INST1 citations52
US11363724B1Jun 14, 2022
Fabrication method of flexible electronic package device
IND TECH RES INST0 citations51
US11061694B2Jul 13, 2021
Reconfigurable data bus system and method thereof
IND TECH RES INST0 citations51
US9029984B2May 12, 2015
Semiconductor substrate assembly
IND TECH RES INST0 citations50
US11239141B2Feb 1, 2022
Lead frame package
IND TECH RES INST0 citations47
US9343393B2May 17, 2016
Semiconductor substrate assembly with embedded resistance element
IND TECH RES INST0 citations47
US12557672B2Feb 17, 2026
Electronic device having substrate
IND TECH RES INST0 citations45
US11955417B2Apr 9, 2024
Electronic device having substrate with electrically floating vias
IND TECH RES INST0 citations45
US11469484B2Oct 11, 2022
Circuit structure
IND TECH RES INST0 citations41