P

Inventor

AGGARWAL ANKUR

US45 patents
⚠️ This page may combine multiple inventors who share the name “AGGARWAL ANKUR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CELESTIAL AI INC

26 patents
US11835777B2Dec 5, 2023

Optical multi-die interconnect bridge (OMIB)

CELESTIAL AI INC28 citations97
US12298608B1May 13, 2025

Optically bridged multicomponent package with extended temperature range

CELESTIAL AI INC10 citations94
US12242122B2Mar 4, 2025

Multicomponent photonically intra-die bridged assembly

CELESTIAL AI INC9 citations94
US12216318B2Feb 4, 2025

Optical bridging element for separately stacked electrical ICs

CELESTIAL AI INC13 citations94
US12124095B2Oct 22, 2024

Optical multi-die interconnect bridge with optical interface

CELESTIAL AI INC10 citations94
US12283584B2Apr 22, 2025

Electrical bridge package with integrated off-bridge photonic channel interface

CELESTIAL AI INC6 citations86
US12191257B2Jan 7, 2025

Electrical bridge package with integrated off-bridge photonic channel interface

CELESTIAL AI INC8 citations86
US12164161B1Dec 10, 2024

Stacked-dies optically bridged multicomponent package

CELESTIAL AI INC3 citations85
US12405434B2Sep 2, 2025

Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute

CELESTIAL AI INC2 citations75
US12392974B2Aug 19, 2025

Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute

CELESTIAL AI INC3 citations75
US12197023B1Jan 14, 2025

Manufacturing optically accessible co-packaged optics

CELESTIAL AI INC2 citations75
US12189198B1Jan 7, 2025

Manufacturing optically accessible co-packaged optics

CELESTIAL AI INC5 citations75
US12468103B2Nov 11, 2025

Optically bridged multicomponent package with extended temperature range

CELESTIAL AI INC1 citations74
US12443000B2Oct 14, 2025

Optically bridged multicomponent package with extended temperature range

CELESTIAL AI INC1 citations74
US12442997B2Oct 14, 2025

Optically bridged multicomponent package with extended temperature range

CELESTIAL AI INC1 citations74
US12442998B2Oct 14, 2025

Optically bridged multicomponent package with extended temperature range

CELESTIAL AI INC2 citations74
US12436346B2Oct 7, 2025

Optically bridged multicomponent package with extended temperature range

CELESTIAL AI INC1 citations74
US12164162B2Dec 10, 2024

Multicomponent photonically bridged assembly

CELESTIAL AI INC1 citations73
US12525595B2Jan 13, 2026

Electrical bridge package with integrated off-bridge photonic channel interface

CELESTIAL AI INC0 citations62
US12442999B2Oct 14, 2025

Optically bridged multicomponent package with extended temperature range

CELESTIAL AI INC0 citations62
US12399333B2Aug 26, 2025

Optical multi-die interconnect bridge with electrical and optical interfaces

CELESTIAL AI INC0 citations62
US12494403B2Dec 9, 2025

Preserving access to optical components on a wafer package with sacrificial die

CELESTIAL AI INC0 citations58
US12571971B2Mar 10, 2026

Converting processing dimensions of a wafer package

CELESTIAL AI INC0 citations57
US12566305B2Mar 3, 2026

Preserving access to edge coupling components on a wafer package

CELESTIAL AI INC0 citations57
US12493155B2Dec 9, 2025

Preserving access to optical components on a wafer package with sacrificial cap

CELESTIAL AI INC0 citations57
US12568809B2Mar 3, 2026

Via formed using a partial plug that stops before a substrate

CELESTIAL AI INC0 citations50

TOWERVIEW HEALTH INC

4 patents

GEORGIA TECH RES INST

3 patents

RESEARCH IN MOTION LTD

2 patents

GOOGLE LLC

2 patents

CHEN LI

1 patent

ACCENTURE GLOBAL SOLUTIONS LTD

1 patent

AMAZON TECH INC

1 patent

ABELLERA SUZANNE

1 patent

BLACKBERRY LTD

1 patent

AGGARWAL ANKUR

1 patent

BESHARATI JALAL

1 patent

SINGH JASJIT

1 patent