Inventor
KAWAMOTO MINEO
23 patents
⚠️ This page may combine multiple inventors who share the name “KAWAMOTO MINEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
20 patentsUS4604160AAug 5, 1986
Method for manufacture of printed wiring board
HITACHI LTD87 citations93
US6190834B1Feb 20, 2001
Photosensitive resin composition, and multilayer printed circuit board using the same
HITACHI LTD44 citations92
US5914216AJun 22, 1999
Multilayer circuit board and photosensitive resin composition used therefor
HITACHI LTD18 citations92
US5849460ADec 15, 1998
Photosensitive resin composition and method for using the same in manufacture of circuit boards
HITACHI LTD26 citations92
US5028513AJul 2, 1991
Process for producing printed circuit board
HITACHI LTD40 citations92
US4099974AJul 11, 1978
Electroless copper solution
HITACHI LTD35 citations92
US4820549AApr 11, 1989
Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition
HITACHI LTD29 citations90
US4151313AApr 24, 1979
Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material
HITACHI LTD26 citations82
US4457952AJul 3, 1984
Process for producing printed circuit boards
HITACHI LTD24 citations81
US4632852ADec 30, 1986
Process for electroless copper plating
HITACHI LTD20 citations80
US4865888ASep 12, 1989
Process for electroless copper plating and apparatus used therefor
HITACHI LTD23 citations79
US4293592AOct 6, 1981
Method for production of printed circuits by electroless metal plating
HITACHI LTD25 citations78
US5712080AJan 27, 1998
Method for manufacturing printed circuit board
HITACHI LTD9 citations74
US4610910ASep 9, 1986
Printed circuit board, process for preparing the same and resist ink used therefor
HITACHI LTD11 citations73
US4239813ADec 16, 1980
Process for forming printed wiring by electroless deposition
HITACHI LTD16 citations73
US4876177AOct 24, 1989
Process for producing printed circuit board
HITACHI LTD17 citations72
US4378384AMar 29, 1983
Process for producing printed circuit board by electroless plating
HITACHI LTD16 citations72
US5356698AOct 18, 1994
Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same
HITACHI LTD16 citations69
US5139923AAug 18, 1992
Method for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereon
HITACHI LTD5 citations62
US6306481B1Oct 23, 2001
Multilayer circuit board having insulating layer with via-holes
HITACHI LTD1 citations51