Inventor
KANDA NAOYA
JP36 patents
⚠️ This page may combine multiple inventors who share the name “KANDA NAOYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
27 patentsUS6791178B2Sep 14, 2004
Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices
HITACHI LTD77 citations98
US6780748B2Aug 24, 2004
Method of fabricating a wafer level chip size package utilizing a maskless exposure
HITACHI LTD150 citations98
US5086337AFeb 4, 1992
Connecting structure of electronic part and electronic device using the structure
HITACHI LTD245 citations98
US6610934B2Aug 26, 2003
Semiconductor module and method of making the device
HITACHI LTD67 citations96
US5089104AFeb 18, 1992
Method and apparatus for forming a multiple-element thin film based on ion beam sputtering
HITACHI LTD73 citations96
US5811877ASep 22, 1998
Semiconductor device structure
HITACHI LTD84 citations95
US4963974AOct 16, 1990
Electronic device plated with gold by means of an electroless gold plating solution
HITACHI LTD74 citations95
US7057283B2Jun 6, 2006
Semiconductor device and method for producing the same
HITACHI LTD26 citations92
US6624504B1Sep 23, 2003
Semiconductor device and method for manufacturing the same
HITACHI LTD43 citations92
US5476726ADec 19, 1995
Circuit board with metal layer for solder bonding and electronic circuit device employing the same
HITACHI LTD41 citations92
US5191624AMar 2, 1993
Optical information storing apparatus and method for production of optical deflector
HITACHI LTD22 citations92
US4922377AMay 1, 1990
Module and a substrate for the module
HITACHI LTD39 citations92
US5202151AApr 13, 1993
Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same
HITACHI LTD29 citations91
US6153938ANov 28, 2000
Flip-chip connecting method, flip-chip connected structure and electronic device using the same
HITACHI LTD38 citations89
US6589802B1Jul 8, 2003
Packaging structure and method of packaging electronic parts
HITACHI LTD24 citations87
US8035522B2Oct 11, 2011
RFID tag
HITACHI LTD9 citations84
US8009047B2Aug 30, 2011
RFID tag
HITACHI LTD11 citations84
US7185823B2Mar 6, 2007
Paper tag identified by using radiofrequency and method of manufacturing the same
HITACHI LTD10 citations84
US7141451B2Nov 28, 2006
Wireless communication medium and method of manufacturing the same
HITACHI LTD20 citations84
US7413130B2Aug 19, 2008
Paper tag identified by using radiofrequency and method of manufacturing the same
HITACHI LTD7 citations74
US5178738AJan 12, 1993
Ion-beam sputtering apparatus and method for operating the same
HITACHI LTD7 citations74
US4817276AApr 4, 1989
Process for producing ceramic substrates for microelectronic circuits
HITACHI LTD7 citations73
US4734233AMar 29, 1988
Ceramic wiring substrate and process for producing the same
HITACHI LTD9 citations73
US4913769AApr 3, 1990
Process for preparing superconductive wiring board
HITACHI LTD9 citations71
US7122087B2Oct 17, 2006
Method of manufacturing RFID
HITACHI LTD6 citations63
US4935285AJun 19, 1990
Ceramic substrates for microelectronic circuits and process for producing same
HITACHI LTD4 citations62
US7190072B2Mar 13, 2007
RFID-chip having RFID-tag or magnifying electrode
HITACHI LTD2 citations61
RENESAS TECH CORP
5 patentsUS6930388B2Aug 16, 2005
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
RENESAS TECH CORP37 citations92
US6822317B1Nov 23, 2004
Semiconductor apparatus including insulating layer having a protrusive portion
RENESAS TECH CORP37 citations92
US6770547B1Aug 3, 2004
Method for producing a semiconductor device
RENESAS TECH CORP40 citations92
US7002250B2Feb 21, 2006
Semiconductor module
RENESAS TECH CORP14 citations81
US7084498B2Aug 1, 2006
Semiconductor device having projected electrodes and structure for mounting the same
RENESAS TECH CORP9 citations74