Inventor
KAWAMOTO YOSHIHISA
JP7 patents
Patents
7 patentsUS5834035ANov 10, 1998
Method of and apparatus for molding resin to seal electronic parts
TOWA CORP91 citations95
US5603879AFeb 18, 1997
Method of molding resin to seal electronic parts using two evacuation steps
TOWA CORP48 citations95
US5435953AJul 25, 1995
Method of molding resin for sealing an electronic device
TOWA CORP76 citations95
US5507633AApr 16, 1996
Resin molding apparatus for sealing an electronic device
TOWA CORP36 citations92
US6773247B1Aug 10, 2004
Die used for resin-sealing and molding an electronic component
TOWA CORP31 citations90
US5753538AMay 19, 1998
Method of sealing electronic parts with molded resin and mold employed therefor
TOWA CORP42 citations89
US5750154AMay 12, 1998
Resin sealing/molding apparatus for electronic parts
TOWA CORP7 citations72