Inventor
TAKEDA HIDEYUKI
JP28 patents
⚠️ This page may combine multiple inventors who share the name “TAKEDA HIDEYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CKD CORP
9 patentsUS8033579B2Oct 11, 2011
Fluid device connecting structure
CKD CORP32 citations92
US11060637B2Jul 13, 2021
Coupling member, fluid-device connecting jig, and fluid-device connecting structure
CKD CORP9 citations84
US7950619B2May 31, 2011
Fluid device mounting structure
CKD CORP7 citations84
US7357368B2Apr 15, 2008
Combined valve
CKD CORP9 citations76
US9228669B2Jan 5, 2016
Fluid control valve
CKD CORP6 citations72
US11073209B2Jul 27, 2021
Connected part seal structure, and seal member
CKD CORP5 citations67
US7556059B2Jul 7, 2009
Tank structure
CKD CORP5 citations58
US9057449B2Jun 16, 2015
Fluid control valve
CKD CORP3 citations56
US9631734B2Apr 25, 2017
Fluid control device manifold, manifold assembling method, and connection tool
CKD CORP1 citations45
IKENOYA SHINJI
4 patentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD
2 patentsUS6636953B2Oct 21, 2003
Receiving apparatus that receives and accumulates broadcast contents and makes contents available according to user requests
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD96 citations94
US7281061B2Oct 9, 2007
Time managing apparatus for managing time to synchronize with other apparatuses
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations63
FUJIPLA INC
2 patentsTAKEDA HIDEYUKI
2 patentsIWATA HIROKI
2 patentsSUMITOMO SEIKA CHEMICALS
2 patentsUS11142611B2Oct 12, 2021
Aliphatic polycarbonate resin for forming partition, partition material, substrate and production method therefor, production method for wiring substrate, and wiring forming method
SUMITOMO SEIKA CHEMICALS0 citations51
US11084902B2Aug 10, 2021
Aliphatic polycarbonate resin, partition material, substrate and production method therefor, production method for wiring substrate, and wiring forming method
SUMITOMO SEIKA CHEMICALS0 citations51